Circuit board and chip package structure
AssigneeVIA Technologies, Inc.
InventorsWen-Yuan Chang, Wei-Cheng Chen, Yeh-Chi Hsu
Life of this patent
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Abstract
A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.
Claims15
A circuit board, comprising:
- a substrate comprising a top surface and a base surface opposite to each other;
- at least a top pad disposed on the top surface and at least a base pad disposed on the base surface;
- a top solder resist layer disposed on the top surface and covering a portion of the top pad and a base solder resist layer disposed on the base surface and covering a portion of the base pad, wherein the top solder resist layer has a first opening exposing a portion of the top pad, and the base solder resist layer has a second opening exposing a portion of the base pad;
- and
- a pre-bump disposed on the top pad and located in the first opening, wherein a conductive layer is formed on the base surface, covering the base solder resist layer and the base pad and electrically connected to the base pad, a plating resist layer is formed on the conductive layer and has a third opening exposing a portion of the conductive layer, wherein after the pre-bump is electroplated on the top pad by applying a current to the conductive layer through the third opening, the plating resist layer and the conductive layer are removed sequentially;
- and wherein the pre-bump has a protrusion protruding from the top solder resist layer, and a maximum width of the protrusion is less than or equal to a width of the top pad.
A chip package structure, comprising:
- a circuit board, comprising:
- a substrate comprising a top surface and a base surface opposite to each other;
- at least a top pad disposed on the top surface;
- a top solder resist layer disposed on the top surface and covering a portion of the top pad, wherein the top solder resist layer has a first opening exposing a portion of the top pad;
- and
- a pre-bump disposed on the top pad and located in the first opening, wherein the pre-bump has a protrusion protruding from the top solder resist layer, and a maximum width of the protrusion is less than or equal to a width of the top pad, and wherein the protrusion has a convex cambered surface;
- a chip disposed on the circuit board, wherein at least a chip pad is disposed on the chip, and a location of the chip pad corresponds to a location of the pre-bump;
- and
- at least a solder bump disposed between the chip and the circuit board to connect the pre-bump and the chip pad.
Dependencies are inferred from the claim text.