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US 8,796,842 B2Granted
Stacked semiconductor chip device with thermal management circuit board
AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsGamal Refai-Ahmed, Michael Z. Su, Bryan Black
Life of this patent
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Abstract
A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip.
Claims25
A method of assembling a semiconductor chip device, comprising:
- providing a circuit board including a first side and a second side opposite to the first side, the second side having an aperture that does not extend to the first side;
- positioning a first heat spreader on the second side, the first heat spreader including a first portion in the aperture and with a surface facing away from the aperture, and a second portion including at least one projection extending beyond the aperture and adapted to thermally contact a second heat spreader;
- and
- positioning a stack on the second side, the stack including a first semiconductor chip positioned on the surface of the first heat spreader and a substrate having a first side coupled to the first semiconductor chip.
1 more element
A method of manufacturing, comprising:
- fabricating a circuit board including a first side and a second side opposite to the first side, the second side having an aperture that does not extend to the first side;
- positioning a first heat spreader on the second side so that a first portion of a first heat spreader is in the aperture and with a surface facing away from the aperture, and a second portion including at least one projection extending beyond the aperture and adapted to thermally contact a second heat spreader;
- and
- positioning a stack on the second side, the stack including a first semiconductor chip positioned on the surface of the first heat spreader and a substrate having a first side coupled to the first semiconductor chip.
1 more element
An apparatus, comprising:
- a circuit board including a first side and a second side opposite to the first side, the second side having an aperture that does not extend to the first side;
- a first heat spreader positioned on the second side and including a first portion positioned in the aperture with a surface facing away from the aperture, and a second portion having at least one projection extending beyond the aperture and adapted to thermally contact a second heat spreader;
- and
- a stack positioned on the second side, the stack including a first semiconductor chip positioned on the surface of the first heat spreader and a substrate having a first side coupled to the first semiconductor chip.
1 more element
An apparatus, comprising:
- a semiconductor chip package substrate including a first side and a second side opposite the first side, the second side having an aperture;
- a first heat spreader positioned on the second side, the first heat spreader including a first portion positioned in the aperture and with a surface facing away from the aperture, and a second portion having at least one projection extending beyond the aperture and adapted to thermally contact a second heat spreader;
- and
- a stack positioned on the second side, the stack including a first semiconductor chip positioned on the surface of the first heat spreader, an interposer having a first side coupled to the first semiconductor chip and a second side, and a second semiconductor chip coupled to the second side.
1 more element
Dependencies are inferred from the claim text.