Semiconductor device with embedded heat spreading

A semiconductor device, comprising:

• a semiconductor substrate;
• a plurality of clock drivers, wherein the plurality of clock drivers comprises substantially all clock drivers of the semiconductor device;
• an interconnect region over the semiconductor substrate, wherein a first metal layer within the interconnect region comprises a plurality of heat spreaders, wherein at least 25% of the plurality of clock drivers have a corresponding heat spreader of the plurality of heat spreaders, wherein each corresponding heat spreader of the plurality of heat spreaders:
• covers at least 50% of a transistor within a corresponding clock driver of the plurality of clock drivers,
• extends across at least 70% of a perimeter of the transistor within the corresponding clock driver, and
• has at least two separate portions.