Package on package having improved thermal characteristics
AssigneeSamsung Electronics Co., Ltd.
InventorsYoon-Hoon Kim, Joong-Hyun Baek, Eun-Seok Cho
Life of this patent
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Abstract
Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.
Claims20
A package on package (POP) having improved thermal characteristics, the POP comprising:
- a first semiconductor package including a first substrate;
- a second semiconductor package on the first semiconductor package, the second semiconductor package including a second substrate and being larger than the first semiconductor package;
- and
- a first heat slug formed on an outermost edge region on a bottom of the second substrate, the first heat slug surrounding and being adjacent to outermost sides of the first substrate.
A package on package (POP) having improved thermal characteristics, the POP comprising:
- a first semiconductor package having at least one first semiconductor chip on a first substrate;
- a second semiconductor package on the first semiconductor package, the second semiconductor package having at least one second semiconductor chip on a second substrate;
- and
- at least one heat slug on a bottom of the second substrate, the at least one heat slug arranged to face at least two sides of the first semiconductor package,
- wherein the first substrate has a substantially smaller horizontal dimension than the second substrate.
Dependencies are inferred from the claim text.