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US 8,796,833 B2Granted
Solder bump for ball grid array
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJung-Hua Chang, Cheng-Lin Huang, Jing-Cheng Lin
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Abstract
A solder bump structure for a ball grid array (BGA) includes at least one under bump metal (UBM) layer and a solder bump formed over the at least one UBM layer. The solder bump has a bump width and a bump height and the ratio of the bump height over the bump width is less than 1.
Claims20
A solder bump structure for a ball grid array (BGA), comprising:
- at least one under bump metal (UBM) layer;
- a solder bump formed over the at least one UBM layer, the solder bump having a bump width and a bump height, wherein a ratio of the bump height over the bump width is less than 1;
- at least one non-metallic core inside the solder bump;
- and
- a conductive layer surrounding the at least one non-metallic core, wherein the solder bump surrounds the conductive layer.
2 more elements
A method of forming a solder bump structure for a ball grid array (BGA), comprising:
- forming at least one under bump metal (UBM) layer over a substrate;
- forming a solder bump over the at least one UBM layer, wherein the solder bump has a bump width and a bump height and a ratio of the bump height over the bump width is less than 1;
- and
- forming at least one non-metallic core inside the solder bump, wherein forming the at least one non-metallic core comprises:
- placing the non-metallic core atop the solder bump;
- and
- reflowing the solder bump.
4 more elements
An integrated circuit, comprising:
- a substrate;
- at least one under bump metal (UBM) layer formed over the substrate;
- a lead-free solder bump formed over the at least one UBM layer, wherein the solder bump has at least one plastic core inside, wherein the solder bump has a bump width and a bump height, and a ratio of the bump height over the bump width is less than 1;
- a conductive layer formed around the at least one plastic core, wherein the solder bump surrounds the conductive layer.
1 more element
Dependencies are inferred from the claim text.