Thermal dissipation through seal rings in 3DIC structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJing-Cheng Lin
Life of this patent
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Abstract
A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the plurality of through-vias, and a plurality of electrical connectors underlying the semiconductor substrate and connected to the seal ring. An interposer is underlying and bonded to the die. The interposer includes a substrate, and a plurality of metal lines over the substrate. The plurality of metal lines is electrically coupled to the plurality of electrical connectors. Each of the plurality metal lines has a first portion overlapped by the first die, and a second portion misaligned with the die. A thermal conductive block encircles the die, and is mounted on the plurality of metal lines of the interposer.
Claims20
A package comprising:
- a first die comprising:
- a first semiconductor substrate;
- a first plurality of through-vias penetrating through the first semiconductor substrate;
- a first seal ring overlapping and connected to the first plurality of through-vias;
- and
- a first plurality of electrical connectors underlying the semiconductor substrate and connected to the first seal ring;
- an interposer underlying and bonded to the first die, wherein the interposer comprises:
- a substrate;
- and
- a plurality of metal lines over the substrate, wherein the plurality of metal lines is electrically coupled to the first plurality of electrical connectors, and wherein each of the plurality metal lines comprises a first portion overlapped by the first die, and a second portion misaligned with the first die;
- and
- a thermal conductive block encircling the first die, wherein the thermal conductive block is mounted on the plurality of metal lines of the interposer.
A package comprising:
- a device die comprising:
- a semiconductor substrate;
- a plurality of through-vias penetrating through the semiconductor substrate;
- a seal ring overlapping and electrically coupled to the plurality of through-vias;
- and
- a plurality of electrical connectors overlying and electrically coupled to the seal ring;
- and
- an interposer underlying and bonded to the device die, wherein the interposer comprises a plurality of metal lines, and wherein each of the plurality of metal lines is bonded to one of the plurality of electrical connectors;
- a thermal conductive ring encircling the device die;
- and
- an adhesive between the plurality of metal lines and the thermal conductive ring.
A method comprising:
- conducting heat in a first die to a first seal ring in the first die;
- and
- conducting the heat from the first seal ring to a metal line in an interposer, wherein the interposer is underlying and bonded to the first die, and wherein the metal line is electrically coupled to the first seal ring through a through-via in a substrate of the first die.
Dependencies are inferred from the claim text.