Compliant interconnects in wafers
AssigneeTessera, Inc.
InventorsVage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell
Life of this patent
Estimating the term…
Abstract
A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element can include a joining portion overlying the recess and extending from an anchor portion supported by the substrate. The joining portion can be at least partially exposed at the major surface for connection to a component external to the microelectronic unit.
Claims12
A method of fabricating a microelectronic unit, comprising:
- removing material from a substrate having a CTE less than 10 ppm/° C. to form a hole extending from a major surface of the substrate to a second surface opposite the major surface;
- forming an electrically conductive element having a joining portion extending above and supported on the major surface, an anchor portion fixed relative to the substrate, and a connecting portion extending downwardly from the joining portion to the anchor portion, a surface of the connecting portion having a contour conforming to a contour of an inner surface of the hole;
- removing material supporting at least a joining portion of the conductive element from the major surface to form a recess such that the joining portion at least partially overlies the recess, and such that the contour of the surface of the connecting portion does not conform to a contour of an inner surface of the recess;
- and
- depositing a material within the recess having a modulus of elasticity less than 10 GPa,
- wherein the joining portion is at least partially exposed at the major surface of the substrate for connection to a component external to the microelectronic unit.
Dependencies are inferred from the claim text.