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US 8,796,816 B2Granted
Semiconductor module with electrical switching elements
AssigneeDenso Corporation
InventorsYuji Hayashi, Yuuichi Handa
Life of this patent
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Abstract
A semiconductor module is provided which is capable of lowering surges caused when switching elements are switched on and off. The module has a plurality of lead frames, switching elements, electronic components, and a sealing member. The switching elements are electrically connected to the lead frames respectively. Part of the lead frames, the switching elements, and the electronic components are sealed by the sealing member. The electronic components are mounted on primary surfaces of the lead frames respectively.
Claims15
A semiconductor module comprising:
- a plurality of lead frames;
- switching elements electrically connected to the lead frames respectively;
- electronic components electrically connected to the switching elements;
- and
- a sealing member that seals at least part of the lead frames, the switching elements, and the electronic components, wherein
- the electronic components are mounted on primary surfaces of the lead frames,
- the electronic components have a pair of connection terminals,
- the electronic components are connected between the two lead frames, and
- the pair of connection terminals are arranged, terminal by terminal, on the primary surfaces of the lead frames, respectively, which are different from each other;
- and
- the electronic components composed of a plurality of electronic components are connected in series via relaying lead frames and two lead frames of the lead frames are electrically connected by both the plurality of electronic components and the relaying lead frames, the two lead frames being positionally separated from each other.
8 more elements
A semiconductor module comprising:
- a plurality of lead frames;
- switching elements electrically connected to the lead frames respectively;
- electronic components electrically connected to the switching elements;
- a sealing member that seals at least part of the lead frames, the switching elements, and the electronic components;
- and
- relaying lead frames positionally separated from the lead frames, wherein
- the electronic components are mounted on primary surfaces of the lead frames,
- the electronic components have a pair of connection terminals, one terminal of the paired connection terminals is mounted on a corresponding one of primary surfaces of the relaying lead frames, and the other connection terminal is mounted on a corresponding one of the primary surfaces of the lead frames, and
- the electronic components composed of a plurality of electronic components are connected in series via the relaying lead frames and two lead frames of the lead frames are electrically connected by both the plurality of electronic components and the relaying lead frames, the two lead frames being positionally separated from each other.
6 more elements
A semiconductor module comprising:
- a plurality of lead frames;
- switching elements electrically connected to the lead frames respectively;
- electronic components electrically connected to the switching elements;
- and
- a sealing member that seals at least part of the lead frames, the switching elements, and the electronic components,
- wherein the electronic components are mounted on primary surfaces of the lead frames and the electronic components are either snubber capacitors or line bypass capacitors, the snubber capacitors being electrically connected parallely with the switching elements respectively to absorb surges caused when the switching elements are switched on and off, the line bypass capacitors being electrically connected between the switching elements and a ground terminal to absorb common mode noise caused when the switching elements are switched on and off.
3 more elements
Dependencies are inferred from the claim text.