MOS P-N junction schottky diode device and method for manufacturing the same
AssigneePFC Device Corp.
InventorsKuo-Liang Chao, Hung-Hsin Kuo, Tse-Chuan Su
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AssigneePFC Device Corp.
InventorsKuo-Liang Chao, Hung-Hsin Kuo, Tse-Chuan Su
Estimating the term…
A MOS P-N junction Schottky diode device includes a substrate having a first conductivity type, a field oxide structure defining a trench structure, a gate structure formed in the trench structure and a doped region having a second conductivity type adjacent to the gate structure in the substrate. An ohmic contact and a Schottky contact are formed at different sides of the gate structure. The method for manufacturing such diode device includes several ion-implanting steps to form several doped sub-regions with different implantation depths to constitute the doped regions. The formed MOS P-N junction Schottky diode device has low forward voltage drop, low reverse leakage current, fast reverse recovery time and high reverse voltage tolerance.
A MOS P-N junction Schottky diode device, comprising:
A MOS P-N junction Schottky diode device, comprising:
Dependencies are inferred from the claim text.