Imaging module, fabricating method therefor, and imaging device

An imaging module comprising:

• an imaging chip including a micro-lens configured to guide incident light and an imaging element provided in a semiconductor substrate and configured to convert the incident light guided by the micro-lens into an electric signal;
• a polarizing glass chip including a polarizing filter glass having a polarizer configured to determine a polarization direction of the incident light and a transparent substrate, the polarizer being arranged on a surface of the transparent substrate such that the polarizer faces the micro-lens of the imaging chip, and a spacer member connected to the polarizing filter glass having the polarizer and configured to adjust a gap between the polarizer and the micro-lens of the imaging chip;
• a structural film provided in outer peripheries of setting regions of the imaging element and the micro-lens;
• and
• an inorganic insulator film,
• wherein a melt-bonding surface of the spacer member is melt-bonded to an upper surface of the structural film such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and such that the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip,
• wherein the micro-lens is formed directly on either the inorganic insulator film or the imaging element, and the structural film is formed directly on either the inorganic insulator film or the semiconductor substrate,
• wherein the spacer member includes a frame structure configured to enclose an outer periphery of the polarizer, and
• wherein the spacer member including the frame structure partially includes a cut portion, and the cut portion is configured to communicate spatially between a light-receiving region of the imaging chip and outside of the light-receiving region such that outgassing is achieved via the cut portion.