Hybrid intergrated component and method for the manufacture thereof
AssigneeRobert Bosch GmbH
InventorsAxel Franke, Patrick Wellner, Lars Tebje
Life of this patent
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Abstract
Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.
Claims9
A component, comprising:
- a carrier;
- a standoff structure;
- an MEMS element including a micromechanical structure and mounted on the carrier via the standoff structure;
- and
- a cap situated above the micromechanical structure of the MEMS element, wherein:
- the MEMS element is implemented in a layered structure including a plurality of functional layers, and
- the micromechanical structure of the MEMS element extends over at least two functional layers of the layered structure that are separated from one another by at least one intermediate layer.
Dependencies are inferred from the claim text.