Method and structure of monolithetically integrated micromachined microphone using IC foundry-compatiable processes

A microphone device comprising:

• a substrate having a surface region;
• a CMOS integrated circuit device layer overlying the surface region of the substrate;
• a diaphragm device having a plurality of surface regions overlying the CMOS integrated circuit device layer, wherein the plurality of surface regions comprises at least one surface region disposed within a center region of the diaphragm and two or more surface regions disposed radially around the center region of the diaphragm, the plurality of surface regions being coupled to the substrate;
• at least one or more folded spring devices spatially disposed within a vicinity of the plurality of surface regions of the diaphragm device, each of the folded spring devices being operably coupled to at least one of the plurality of surface regions of the diaphragm device;
• two or more electrode devices operably coupled to each of the plurality of surface regions;
• and
• at least one air channel formed between the two or more electrode devices.