Light emitting element and method for manufacturing light emitting element

A method for manufacturing a light emitting element, comprising:

• preparing a stacked body obtained by sequentially laminating an optical semiconductor layer, a first metal layer, and a second metal layer having a higher melting point than that of an oxide of the first metal layer;
• forming a plurality of through holes that penetrate the second metal layer in a thickness direction thereof;
• and
• oxidizing an interfacial area of the optical semiconductor layer with the first metal layer by heating the stacked body at a temperature that is higher than the melting point of an oxide of the first metal layer and is lower than a melting point of the first metal layer and the melting point of the second metal layer.

A light emitting element, comprising:

• an optical semiconductor layer in which a first semiconductor layer, a light emitting layer, and a second semiconductor layer are sequentially laminated;
• a first electrode layer that is electrically connected to the first semiconductor layer;
• and
• a second electrode layer that is electrically connected to the second semiconductor layer, and comprising:
• a conductive reflecting layer positioned on the second semiconductor layer;
• and
• a conductive layer positioned on the conductive reflecting layer, the conductive layer comprising a plurality of through holes penetrating therethrough in a thickness direction thereof, a part of a surface of the conductive reflecting layer being exposed,
• the conductive reflecting layer comprising recesses at portions thereof corresponding to the through holes, and
• each of the recesses including a first cross-sectional area, which is an area of the cross-section that is perpendicular to the thickness direction of the conductive reflecting layer, increasing toward a side of the conductive layer.