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US 8,796,717 B2Granted
Light-emitting diode package and manufacturing method thereof
AssigneeLG Innotek Co., Ltd.
InventorKyung Ho Shin
Life of this patent
Estimating the term…
Abstract
An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
Claims20
A light emitting diode package, comprising:
- a metal layer having a top surface and a bottom surface, the top surface comprising a first portion having a planar surface and a second portion around the first portion;
- a light emitting diode chip on the first portion of the metal layer;
- a reflective layer on both the first portion and the second portion of the metal layer;
- and
- an optical member disposed on the metal layer and covering the light emitting diode chip,
- wherein at least one groove is formed on the second portion of the metal layer;
- wherein a lower portion of the metal layer comprises at least one surface having different height from the bottom surface of the metal layer;
- wherein the at least one groove is not vertically overlapped with the first portion having the planar surface;
- and
- wherein no light emitting diode chip is present in the at least one groove.
7 more elements
A light emitting device comprising a light emitting diode package, the light emitting diode package comprising:
- a metal layer having a first portion of an upper surface and a second portion of the upper surface around the first portion, the first portion having a surface with a substantially flat portion;
- a light emitting diode chip on the first portion of the metal layer;
- a reflective layer on both the first portion and the second portion of the metal layer;
- and
- an optical member disposed on the metal layer and covering the light emitting diode chip,
- wherein at least one groove is formed on the second portion of the metal layer;
- wherein a lower portion of the metal layer comprises at least one surface having different height from a bottom surface of the metal layer,
- wherein the at least one groove is not vertically overlapped with the first portion having a planar surface, and
- wherein no groove is vertically overlapped with the first portion.
6 more elements
Dependencies are inferred from the claim text.