Light emitting diode package
AssigneeSeoul Semiconductor Co., Ltd.
InventorBang Hyun Kim
Life of this patent
Estimating the term…
Abstract
Exemplary embodiments of the present invention provide light emitting diode (LED) packages which include a housing configured to surround uplift portions formed on lead frames electrically connected to an LED chip. The LED package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip, the first lead frame and the second lead frame respectively including a first uplift portion and a second uplift portion on regions thereof facing each other, and a housing supporting the first lead frame and the second lead frame, a first side of the housing exposed to the outside. The first lead frame and the second lead frame each include a first side parallel to the first side of the housing and a second side opposite to the first side.
Claims22
A light emitting diode (LED) package, comprising:
- an LED chip;
- a first lead frame and a second lead frame electrically connected to the LED chip, the first lead frame and the second lead frame respectively comprising a first uplift portion and a second uplift portion on facing regions thereof;
- and
- a housing supporting the first lead frame and the second lead frame, a first side of the housing exposed to the outside,
- wherein the first lead frame and the second lead frame each comprise a first side parallel to the first side of the housing and a second side opposite to the first side,
- wherein the housing comprises an external housing and an internal housing exposing at least a first portion of the first lead frame or the second lead frame,
- wherein the frame structure surrounds the internal housing,
- wherein the external housing comprises a frame structure and a cavity having a sidewall, and the internal housing is disposed inside the cavity, and
- wherein the internal housing extends from the frame structure across the cavity and is disposed on a second portion of the first lead frame and the second lead frame across the cavity.
Dependencies are inferred from the claim text.