Emissive device with chiplets

An emissive device, comprising:

• a device substrate having a device substrate surface;
• an adhesive layer formed over at least a portion of the device substrate surface;
• a chiplet, with a substrate separate from the device substrate, adhered to the device substrate surface by the adhesive layer, the chiplet having one or more connection pads;
• a bottom electrode formed directly on the device substrate surface, one or more organic or inorganic light-emitting layers formed over the bottom electrode, and a top electrode formed over the one or more organic or inorganic light-emitting layers such that the bottom electrode, the one or more organic or inorganic light-emitting layers and the top electrode define an LED spaced from the chiplet;
• an insulating transition layer formed over only a portion of the chiplet and only a portion of the device substrate surface, the insulating transition layer exposing at least one connection pad;
• and
• an electrical conductor formed over the transition layer in electrical contact with the exposed connection pad and the bottom electrode;
• wherein the bottom surface of the chiplet and a bottom surface of the bottom electrode are substantially a same height above the device substrate surface;
• and
• further comprising one or more busses formed directly on the device substrate surface.