Semiconductor device including transistor chips having oblique gate electrode fingers

A semiconductor device comprising:

• a package;
• an input matching circuit and an output matching circuit in the package;
• and
• a plurality of transistor chips between the input matching circuit and the output matching circuit in the package, wherein
• each transistor chip includes a semiconductor substrate having two long sides and two short sides, which are shorter than the long sides, and a gate electrode, a drain electrode, and a source electrode on the semiconductor substrate,
• the gate electrode has a plurality of gate fingers arranged along the long sides of the semiconductor substrate, and a gate pad commonly connected to the plurality of gate fingers and connected to the input matching circuit via a first wire,
• the drain electrode is connected to the output matching circuit via a second wire, and
• the long sides of the semiconductor substrates of the plurality of transistor chips are oblique with respect to an input/output direction extending from the input matching circuit to the output matching circuit.