Charged particle beam lithography system and target positioning device

A charged particle beam lithography system (1) comprising:

• a charged panicle optical column (4) arranged in a vacuum chamber for writing a charged particle beam (2) on a wafer, wherein the column comprises deflecting means (41) for deflecting the charged particle beam (2) in a deflection direction (Y),
• a target positioning device (5) comprising a carrier (51, 54;
• 844) for carrying the wafer (3), which carrier is provided with opposite side faces, said target positioning device further comprising a stage (52;
• 84) comprising opposing sidewalls (521), wherein said opposite side faces of said carrier are arranged between and facing said opposing sidewalls of said stage and parallel to said sidewalls, wherein said stage is adapted for carrying and moving the carrier supported by a linear bearing along a first direction (X), wherein the first direction (X) is different from the deflection direction (Y), wherein the target positioning device (5) comprises a first actuator (53) for moving the stage (52;
• 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wailer,
• wherein the carrier (51, 54;
• 844) is displaceably arranged on the stage (52;
• 84), and is displaceable relative to said stage along a second direction which is different from said first direction and parallel to said sidewalls, and wherein the carrier, at said opposite side laces, comprises clamping means (541) comprising two opposed piezoelectric elements for releasably clamping the carrier (51, 54;
• 844) between said opposing sidewalls of the stage such that the position of the carrier is locked with respect to the stage (52;
• 84) in a first relative position,
• wherein the clamping means (541;
• 91, 92, 91′, 92′) are arranged for being activated for locking the carrier (51, 54;
• 844) in said first relative position with respect to the stage (52;
• 84) before writing the charged particle beam (2) on the wafer (3),
• wherein the carrier is at least one of interposed and restrained between said two opposed piezoelectric elements (541;
• 91, 91′).

A charged particle beam lithography system (1) comprising:

• a charged particle optical column (4)
• a target positioning device (5) comprising a carrier (51,54;
• 844) for carrying a wafer (3), which carrier (51,54;
• 844) is provided with opposite side faces, said target positioning device further comprising a stage (52;
• 84) comprising opposing sidewalls (521), wherein said opposite side faces of said carrier (51,54;
• 844) are arranged between and facing said opposing sidewalls (521) of said stage (52;
• 84), wherein said stage is adapted for carrying and moving the carrier supported by a linear bearing along a first direction (X), wherein the target positioning device (5) comprises a first actuator (53) for moving the stage (52;
• 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
• wherein the carrier (51, 54;
• 844) is displaceably arranged on the stage (52;
• 84), and is displaceable relative to said stage along a second direction which is different from said first direction and wherein the stage, at the opposing side walls comprises clamping means (541) for releasably clamping said opposite side faces of the carrier (51, 54;
• 844) therebetween such that the position of the carrier is locked with respect to the stage (52;
• 84) in a first position,
• wherein the clamping means (541;
• 91,92,91′,92′) are arranged for being activated for locking the carrier (51, 54;
• 844) in said first position with respect to the stage (52;
• 84) before writing the charged particle beam (2) on the wafer (3),
• wherein the carrier is at least one of interposed and restrained between said clamping means (541;
• 91,91′).

A charged particle beam lithography system (1) comprising:

• a charged particle optical column (4)
• a target positioning device (5) comprising a carrier (51,54;
• 844) for carrying a wafer (3), which carrier is provided with opposite side faces, said target positioning device further comprising a stage (52:
• 84) comprising opposing sidewalls (521), wherein said opposite side faces of said carrier are arranged between and facing said opposing sidewalls of said stage, wherein said stage is adapted for carrying and moving the carrier supported by a linear bearing along a first direction (X), wherein the target positioning device (5) comprises a first actuator (53) for moving the stage (52;
• 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
• wherein the carrier (51, 54;
• 844) is displaceably arranged on the stage (52;
• 84), and is displaceable relative to said stage along a second direction which is different from said first direction, and wherein the carrier, at said opposite side faces, comprises clamping means (541) for releasably clamping the carrier (51, 54;
• 844) between said opposing sidewalls of the stage such that the position of the carrier is locked with respect to the stage (52;
• 84) in a first position,
• wherein the clamping means (541;
• 91,92,91′,92′) are arranged for being activated for locking the carrier (51, 54;
• 844) in said first position with respect to the stage (52;
• 84) before writing the charged particle beam (2) on the wafer (3),
• wherein the carrier is at least one of interposed and restrained between said clamping means (541;
• 91,91′).