Base of surface-mount electronic component package, and surface-mount electronic component package

A base of a surface-mount electronic component package to hold an electronic component element and to be mounted on a circuit board with a conductive bonding material, the base comprising:

• a principal surface;
• at least one external connection terminal to be electrically connected to the circuit board, the at least one external connection terminal being formed in the principal surface;
• a bump formed on the at least one external connection terminal, the bump being smaller than the at least one external connection terminal;
• and
• a distance d between an outer periphery end edge of the at least one external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the at least one external connection terminal, the stress being generated in association of mounting of the base on the circuit board, the stress attenuating along the attenuating direction of stress,
• wherein the distance d is more than 0.00 mm and equal to or less than 0.45 mm.