Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method

A production method of a polyhydroxyimide, comprising:

• adding an acid component that is at least one type of carboxylic acid having a pKa of 0 to 5 to a polyhydroxyimide precursor having a unit structure of Formula (7):
• wherein X is a tetravalent aliphatic or aromatic group,
• A is either an organic group containing an aromatic group substituted with at least one OH group or a group of Formula (9):
• wherein R31 to R34 are independently a hydrogen atom, a C1-10 alkyl group, a C1-10 haloalkyl group, a C1-10 alkoxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group, a sulfo group, a phenyl group which is optionally substituted with W3, a naphthyl group which is optionally substituted with W3, a thienyl group which is optionally substituted with W3 or a furyl group which is optionally substituted with W3,
• W3 is a C1-10 alkyl group, a C1-10 haloalkyl group, a C1-10 alkoxy group, a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group or a sulfo group,
• Z7 to Z9 are independently a single bond, a C1-10 alkylene group which is optionally substituted with W4, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)2— or —C(O)—, and W4 is a C1-10 alkyl group, a C1-10 haloalkyl group or a C1-10 alkoxy group, with proviso that the polyhydroxyimide precursor contains a unit structure containing the organic group containing an aromatic group substituted with at least one OH group and a unit structure containing the group of Formula (9);
• and
• heating the resultant mixture to a temperature of 50 to 100° C. to prepare a polyimide of Formula (8):
• wherein X and A are the same as those defined above,
• the polyhydroxyimide has a weight average molecular weight of 3,000 to 100,000, and
• the polyhydroxyimide has an imidization rate of 85% or more.