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US 8,796,377 B2Granted
Pressure-sensitive hot-melt adhesives adhering to flexible substrates
AssigneeHenkel AG & Co. KGaA
InventorsHolger Tönniessen, Annie Seiler, Rainer Rauberger, Ralf Grauel
Life of this patent
Estimating the term…
Abstract
The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.
Claims15
A hot melt pressure sensitive adhesive comprising:
- a) 1 to 30 wt. % of at least one ethylene-vinyl acetate copolymer with a melting temperature greater than 70° C.;
- b) 2 to 50 wt. % of a block copolymer that includes a styrene-isoprene-butylene copolymer, in a weight ratio of 10:1 to 1:2 to the total block copolymer, wherein the block copolymer is selected from the group consisting of styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-ethylene/butylene copolymer, styrene-ethylene/propylene-styrene copolymer, styrene-isoprene-butylene copolymer and mixtures thereof,
- c) 20 to 70 wt. % of a tackifying resin;
- and
- d) 5 to 40 wt. % of a plasticizer which is a mixture of at least one oil and at least one ester;
- wherein the sum of the adhesive components equals to 100% and
- wherein the hot melt pressure sensitive adhesive is characterized as re-detachable.
4 more elements
A hot melt adhesive comprising:
- a) 1 to 30 wt. % of at least one ethylene-vinyl acetate copolymer with a melting temperature greater than 70° C.;
- b) 2 to 50 wt. % of a block copolymer consisting of styrene-butadiene copolymer and styrene-isoprene-butylene copolymer, wherein the weight ratio of styrene-isoprene-butylene copolymer to the total block copolymer is in the range of 10:1 to 1:2;
- c) 20 to 70 wt. % of a tackifying resin;
- and
- d) 5 to 40 wt. % of a plasticizer which is a mixture of at least one oil and at least one adipate or its derivatives;
- wherein the sum of the adhesive components equals to 100% and
- wherein the adhesive is a redetachable pressure sensitive adhesive.
4 more elements
A redetachable hot melt pressure sensitive adhesive comprising:
- a) 1 to 30 wt. % of at least one ethylene-vinyl acetate copolymer with a melting temperature greater than 70° C.;
- b) 2 to 50 wt. % of styrene-isoprene-butylene copolymer and styrene-butadiene copolymer or styrene-isoprene copolymer, wherein the weight ratio of styrene-isoprene-butylene copolymer to the total styrene copolymer is in the range of 10:1 to 1:2
- c) 20 to 70 wt. % of a tackifying resin;
- and
- d) 5 to 40 wt. % of a plasticizer which is a mixture of at least one oil and at least one ester;
- wherein the sum of the adhesive components equals to 100%.
3 more elements
Dependencies are inferred from the claim text.