Prepreg, metal-clad laminate, printed wiring board, and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorShoichi Osada
Life of this patent
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Abstract
A prepreg that yields a semiconductor device which, even when using Cu wire, exhibits excellent reliability under conditions of high temperature and high humidity (heat-resistant and moisture-resistant reliability), a metal-clad laminate and a printed wiring board that use the prepreg, and a semiconductor device that uses the printed wiring board. Specifically disclosed are a prepreg comprising a substrate and a B-staged resin composition comprising (a) a thermosetting resin, (b) a hydrotalcite compound having a specific composition, (c) zinc molybdate, and (d) lanthanum oxide.
Claims4
A prepreg comprising a substrate and a B-staged resin composition comprising:
- (a) 100 parts by mass of a thermosetting resin,
- (b) 1 to 5 parts by mass of a hydrotalcite compound represented by formula (1) shown below:
- MgxAly(OH)2x+3y−2z(CO3)z.mH2O (1)
- wherein x and y are positive numbers, and z represents 0 or a positive number, provided that x, y and z satisfy 0<y/x≦1 and 0≦z/y<1.5, and m represents a positive number,
- (c) at least 0.5 parts by mass of zinc molybdate, and
- (d) 0.2 to 1 part by mass of lanthanum oxide,
- wherein the resin composition is impregnated into the substrate.
Dependencies are inferred from the claim text.