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US 8,796,374 B2Granted
Conditioner for electroless plating
AssigneeRohm and Haas Electronic Materials LLC
InventorKatsuhiro Yoshida
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Abstract
A conditioner, surface treatment method, and metal plating film forming method for a moist method of providing a plating film with strong adhesion towards a surface with low roughness without forming a metal film or performing an adhesion promoter pretreatment using a wet method, when plating a resin substrate containing a blend of resin material and glass material, and the like.
Claims5
A method comprising:
- a) providing a substrate containing a resin;
- b) contacting the resin with a conditioner comprising a cationic polymer, a nonionic surfactant, a chelating agent chosen from monoalkylamines, dialkylamines and trialkylamines and between 5 and 200 g/L of ammonium bifluoride;
- c) contacting the resin with a catalyst;
- and
- d) contacting the resin with an electroless cooper plating bath to electrolessly plate copper on the resin of the substrate.
2 more elements
Dependencies are inferred from the claim text.