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US 8,796,158 B2Granted
Methods for forming circuit pattern forming region in an insulating substrate
AssigneeSamsung Electronics Co., Ltd.
InventorKyoung-sei Choi
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Abstract
A method for forming a circuit pattern forming region in an insulating substrate may include preparing a metallic pattern, coating a polymer solution on a casting vessel, precuring the polymer solution, and forming an imprinted circuit pattern forming region in the precured polymer solution using the metallic pattern.
Claims20
A method for forming a circuit pattern forming region in an insulating substrate, the method comprising:
- preparing a metallic pattern;
- coating a polymer solution on a casting vessel;
- precuring the polymer solution;
- and
- forming an imprinted circuit pattern forming region in the precured polymer solution using the metallic pattern;
- wherein the imprinted circuit pattern forming region includes thinner portions of the precured polymer solution than portions of the precured polymer solution not in the imprinted circuit pattern forming region.
3 more elements
Dependencies are inferred from the claim text.