Method for forming tantalum nitride film

A method for forming a tantalum nitride film comprising the steps:

• using a composite type electrical connection film-forming apparatus equipped with a film-forming section comprising:
• a film-forming chamber,
• a sputtering device, and
• an electrical connection film-forming chamber;
• simultaneously introducing a raw gas comprising
• a coordination compound comprising an elemental tantalum (Ta) having a coordinated ligand representable by the general formula:
• N═(R, R′), and
• NH3 gas
• into a film-forming chamber;
• wherein R and R′ may be the same or different and each represents an alkyl group having 1 to 6 carbon atoms,
• reducing the raw gas with NH3 gas and forming a reduced compound film on a substrate to thus partially remove the R or R′ groups bonded to the N atoms in the reduced compound film;
• then introducing a hydrogen atom-containing gas without the raw gas into the chamber;
• reacting the hydrogen atom-containing gas with the reduced compound film to form a tantalum nitride film rich in tantalum atoms;
• implanting tantalum particles into the resulting tantalum nitride film according to a sputtering technique which makes use of a target containing tantalum as a principal constituent, while controlling a DC power and an RF power in such a manner that the DC power is set at a level of not more than 5 kW and the RF power is set at a value ranging from 400 to 800 W;
• and
• forming an electrical connection-film, in the electrical connection film-forming chamber, on the tantalum nitride film thus obtained.