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US 8,796,139 B2Granted
Embedded wafer level ball grid array bar systems and methods
AssigneeStmicroelectronics Pte Ltd
InventorsAnandan Ramasamy, Yonggang Jin, Yun Liu
Life of this patent
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Abstract
A bar formed from a reconstituted wafer and containing one or more conductive material filled voids is used to electrically and physically connect the top and bottom packages in a package-on-package (PoP) package. The bar is disposed in the fan out area of the lower package forming the PoP package.
Claims18
A ball grid array method, comprising:
- forming a reconstituted wafer about a plurality of dies;
- forming a plurality of voids in the reconstituted wafer, the plurality of voids extending perpendicularly from a first reconstituted wafer surface into the reconstituted wafer;
- filling the plurality of voids with a conductive material;
- forming a plurality of bars that each include a portion of the plurality of voids filled with conductive material by separating the reconstituted wafer;
- forming a semiconductor package by covering portions of at least one of the bars and at least one semiconductor die with a protective material;
- forming a first redistribution layer on a first surface of the semiconductor package, the first surface comprising an exposed portion of the first reconstituted wafer surface;
- and
- forming a second redistribution layer on a second surface of the semiconductor package, the second surface opposite the first surface;
- the second surface comprising an exposed portion of a second surface of the reconstituted wafer, the second reconstituted wafer surface opposite the first reconstituted wafer surface.
6 more elements
A ball grid array method, comprising:
- forming a reconstituted wafer about a plurality of dies;
- forming a plurality of voids in the reconstituted wafer, the plurality of voids extending perpendicularly from a first reconstituted wafer surface into the reconstituted wafer;
- filling the plurality of voids with a conductive material;
- forming a plurality of bars by separating the reconstituted wafer, each of the plurality of bars including at least one void filled with conductive material;
- forming a semiconductor package by covering at least side surfaces of one of the bars and at least side surfaces of a semiconductor die;
- forming a first redistribution layer on a first package surface of the semiconductor package, the first package surface comprising an exposed portion of the first reconstituted wafer surface;
- and
- forming a second redistribution layer on a second package surface of the semiconductor package, the second package surface opposite the first package surface, the second package surface comprising an exposed portion of a second surface of the reconstituted wafer, the second reconstituted wafer surface opposite the first reconstituted wafer surface.
5 more elements
Dependencies are inferred from the claim text.