System and method for forming uniform rigid interconnect structures

A method for mounting semiconductor package comprising:

• providing a target package having one or more mounting pads disposed on a first side of the target package;
• applying a mask to the first side of the target package, the mask having a plurality of openings;
• mounting each of one or more interconnects comprising a first material to the mounting pads through a respective one of the plurality of openings in the mask, each of the one or more interconnects having a mounting node comprising the first material and disposed at a first end of a first portion of the interconnect, wherein each mounting node has a mounting surface disposed nearest the respective mounting pad after mounting, the mounting surface having a width wider than a width of the first portion of the respective interconnect;
• cutting the one or more interconnects to a rough length;
• trimming the one or more interconnects to a predetermined and substantially uniform height;
• and
• mounting at least one top package to the target package by bonding mounting pads on the top package to the one or more interconnects.

A method for attaching a plurality of semiconductor devices comprising:

• providing a target package having one or more mounting pads;
• applying a mask to a first side of the target package, the mask having a plurality of openings;
• forming one or more interconnects in place on each of the mounting pads;
• mounting each of the one or more interconnects to each mounting pad through the openings by bonding a first end of the interconnect to the mounting pads, the first end of the interconnect of a same material as the interconnect, wherein the first end of the interconnect deforms during the mounting;
• trimming each interconnect to a height selected from a group of predetermined heights and to accept one or more top packages;
• and
• mounting the one or more top packages to the target package by bonding mounting pads on the top package to the at least one interconnect.