Method for handling a thin substrate and for substrate capping

A method for bonding, the method comprising:

• providing a handle substrate having a first surface and a second surface opposite to the first surface;
• forming a bonding material on the first surface of the handle substrate;
• forming an opening through the handle substrate, the opening extending from the first surface of the handle substrate to the second surface of the handle substrate;
• bonding a first surface of a capping substrate to the bonding material on the first surface of the handle substrate;
• processing a second surface of the capping substrate while the first surface of the capping substrate is bonded to the bonding material, the processing including etching and thinning;
• bonding a second surface of the capping substrate to an active substrate;
• and
• removing the bonding material by using, at least partially, the opening.

A method for bonding, the method comprising:

• bonding a handle substrate to a surface of a capping substrate using a bonding material, the handle substrate having openings extending from a first surface of the handle substrate to a second surface of the handle substrate;
• thinning the capping substrate on a surface of the capping substrate opposite to the surface of the capping substrate bonded to the handle substrate thereby forming a thinned surface of the capping substrate;
• etching a dicing line through the thinned surface of the capping substrate;
• after the thinning the capping substrate and the etching the dicing line, bonding the thinned surface of the capping substrate to an active substrate;
• and
• after the bonding the thinned surface to the active substrate, providing a substance through the openings to cause a chemical reaction with the bonding material, the chemical reaction removing the bonding material.