Semiconductor device

A method comprising:

• preparing a package substrate, the package substrate comprising:
• a substrate with a slot that is selectively formed in the substrate to penetrate therethrough, the substrate thereby including a first edge defining a first side of the slot, the substrate further including a first bonding finger formation area in an end section of the first edge and a second bonding finger formation area in a central section of the first edge that is adjacent to the end section;
• a first bonding finger array, wherein the first bonding finger formation area consists of the first bonding finger array that consists of a first line in which a plurality of first bonding fingers are arranged in line along the end section of the first edge at a first distance from the end section of the first edge;
• and
• a second bonding finger array, wherein the second bonding finger formation area comprises the second bonding finger array, the second bonding finger array including a second line in which a plurality of second bonding fingers are arranged in line along the central section of the first edge at a second distance from the central section of the first edge, the second distance being greater than the first distance;
• mounting a semiconductor chip, that comprises a plurality of die pads, on the package substrate such that the die pads are exposed by the slot of the substrate;
• and
• connecting a plurality of bonding wires such that the die pads of the semiconductor chip are connected to the first and second bonding fingers, respectively, through the slot of the substrate.