Stacked semiconductor devices and fabrication method/equipment for the same
AssigneeKabushiki Kaisha Toshiba
InventorsAtsushi Yoshimura, Shoko Omizo
Life of this patent
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Abstract
After formation of an opening by exposing and development of the photosensitive surface protection film and adhesive layer which is formed on the circuit side of the semiconductor wafer, the semiconductor chips having a photosensitive surface protection film and adhesive layer thereon is fabricated by cutting individual chips from the semiconductor wafer. After the second semiconductor chip is placed over the first semiconductor chip up by the suction collet, the second semiconductor chip is bonded with the first semiconductor chip by the first surface protection film and adhesive layer. The suction side of the suction collet has lower adhesion to the second semiconductor chip than that between the now bonded semiconductor chips.
Claims15
A fabrication method of providing stacked semiconductor devices from a semiconductor wafer having multiple chip areas and dicing areas, comprising the steps of:
- forming a surface protection and adhesive layer onto a circuit side of the semiconductor wafer;
- forming an opening through the surface protection and adhesive layer to expose respective electrode pads on the circuit side of the multiple chip areas and the dicing areas;
- partitioning the semiconductor wafer into a plurality of individual chips that include first and second semiconductor chips;
- positioning a non-circuit side of the semiconductor wafer on a support sheet;
- holding a first semiconductor chip on a suction collet and removing the first semiconductor chip from the support sheet, positioning the first semiconductor chip on an adhesive layer of a receiving substrate, and heating the receiving substrate to bond the first semiconductor chip to the receiving substrate;
- and
- holding a second semiconductor chip on the suction collet and removing the second semiconductor chip from the support sheet, positioning the second semiconductor chip directly on the surface protection and adhesive layer of the first semiconductor chip, and bonding the first semiconductor chip to the second semiconductor chip, wherein
- the suction collet has a suction side with lower adhesion to the surface protection and adhesive layer than that between the first semiconductor chip and the second semiconductor chip.
A manufacturing apparatus of semiconductor devices comprising:
- a pickup section configured to sequentially pick up a plurality of semiconductor chips formed on a semiconductor wafer including:
- a first semiconductor chip where a first photosensitive surface protection film and adhesive layer is formed on a circuit side thereof, and
- a second semiconductor chip where a second photosensitive surface protection film and adhesive layer is formed on a circuit side thereof, and
- a chip bonding section where the first semiconductor chip picked up by the suction collet is to be bonded to a substrate, and
- the second semiconductor chip picked up by the suction collet is disposed onto the first semiconductor chip and
- directly bonded to the first semiconductor chip by the first photosensitive surface protection film and adhesive layer,
- wherein the suction collet has lower adhesion to the either of the first and second photosensitive surface protection film and adhesive layers than that between the first and second semiconductor chips.
Dependencies are inferred from the claim text.