Method and system for a semiconductor device package with a die-to-die first bond

A method for semiconductor packaging, the method comprising:

• Generating a semiconductor package in a die-to-die first bond process, said process comprising:
• bonding one or more semiconductor die comprising electronic devices to an interposer die;
• applying an underfill material between said one or more semiconductor die and said interposer die;
• applying a mold material to encapsulate the one or more bonded semiconductor die;
• thinning said interposer die to expose through-silicon-vias (TSVs);
• applying metal contacts to said exposed TSVs;
• and
• bonding said interposer die with the bonded one or more semiconductor die to a packaging substrate, wherein said bonding of said one or more semiconductor die comprises:
• adhering said one or more semiconductor die to an adhesive layer;
• and
• bonding the adhered one or more semiconductor die to said interposer die.

A method for semiconductor packaging, the method comprising:

• generating a semiconductor package in a die-to-die first bond process, said process comprising:
• placing a first surface of one or more semiconductor die comprising electronic devices on an adhesive layer;
• bonding an opposite surface of said one or more semiconductor die to an interposer die;
• removing said adhesive layer from said first surface of said one or more semiconductor die;
• applying an underfill material between said one or more semiconductor die and said interposer die;
• applying a mold material to encapsulate the one or more bonded semiconductor die;
• and
• bonding said interposer die with the bonded one or more semiconductor die to a packaging substrate.