Thermal dissipation substrate
AssigneeNational Chiao Tung University
InventorsYewChung Sermon Wu, Tai-Min Chang, Yu Chia Chiu, Jen-Li Hu
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Abstract
The present invention related to a method for manufacturing a thermal dissipation substrate and a thermal dissipation substrate. The method includes steps of: (a) providing a substrate body having a surface; (b) forming a plurality of concave regions on the surface; and (c) filling the plurality of concave regions with a plurality of diamond materials. The thermal dissipation substrate includes: a substrate having a surface at a first horizontal; a plurality of regions formed on the surface at a second horizontal; and a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions.
Claims16
A method for manufacturing a thermal dissipation substrate, comprising steps of:
- (a) providing a substrate body having a surface;
- (b) forming a plurality of concave regions on the surface and correspondingly presenting a plurality of protruding regions;
- (c) filling the plurality of concave regions with a plurality of diamond materials;
- (d) bonding the substrate body and an electronic element by a wafer bonding technique;
- and
- (e) cutting the bonded substrate body at bonding junctions, each of which is formed between a specific one of the plurality of protruding regions and the electronic element whereby the cutting avoids cutting through the plurality of concave regions with the plurality of diamond materials.
A method for manufacturing a thermal dissipation substrate, comprising steps of:
- providing a substrate body having a surface at a first horizontal;
- forming a plurality of first regions having edges at a second horizontal and formed on the surface;
- correspondingly presenting a plurality of protruding second regions at the first horizontal;
- disposing a plurality of materials having a relatively high thermal coefficient onto the plurality of regions;
- bonding the substrate body and an electronic element;
- and
- cutting the bonded substrate body at bonding junctions, each of which is formed between a specific one of the plurality of protruding second regions and the electronic element whereby the cutting avoids cutting through the plurality of concave regions with the plurality of diamond materials.
A thermal dissipation substrate, comprising:
- a substrate having a surface at a first horizontal;
- a plurality of first regions having edges at a second horizontal and formed on the surface;
- a plurality of protruding second regions correspondingly presented at the first horizontal;
- a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions;
- an electronic element bonded with the substrate body;
- and
- cutting areas located at bonding junctions, each of which is formed between a specific one of the plurality of protruding second regions and the electronic element whereby the cutting avoids cutting through the plurality of concave regions with the plurality of diamond materials.
Dependencies are inferred from the claim text.