Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed

A method of forming an electronic device, comprising:

• forming an opening in a substrate having a plurality of electrically conductive layers;
• physically attaching a die to the substrate to position a first active surface portion of the die adjacent the opening of the substrate and, through this physical attachment, electrically connecting the die to at least some of the electrically conductive layers in the substrate, the die further including a second active surface portion exposed through an opening of the die;
• and
• forming a protective package to house the substrate and the die, the protective package leaving the opening of the substrate and the opening of the die exposed;
• the method further comprising forming a barrier element surrounding the opening of the substrate, the barrier element comprising an irregular shape in contact with the substrate and the die, and whose external edge is completely coated by the protective package.

A method of forming an electronic device, comprising:

• forming an opening in a substrate having a plurality of electrically conductive layers;
• physically attaching a die to the substrate to position a first active surface portion of the die adjacent the opening of the substrate and, through this physical attachment, electrically connecting the die to at least some of the electrically conductive layers in the substrate, the die further including a second active surface portion exposed through an opening of the die;
• and
• forming a protective package to house the substrate and the die, the protective package leaving the opening of the substrate and the opening of the die exposed;
• the method further comprising:
• coating the die with a non-wettable insulating layer and a protection layer, and
• forming a barrier element having an irregular area between the substrate and the die by removing the protection layer from the die and exposing the non-wettable insulating layer.

A method of forming an electronic device, comprising:

• forming an opening in a substrate having a plurality of electrically conductive layers;
• physically attaching a die to the substrate to position a first active surface portion of the die adjacent the opening of the substrate and, through this physical attachment, electrically connecting the die to at least some of the electrically conductive layers in the substrate, the die further including a second active surface portion exposed through an opening of the die;
• and
• forming a protective package to house the substrate and the die, the protective package leaving the opening of the substrate and the opening of the die exposed;
• the method further comprising forming a cylindrical projection on the opening of the substrate to facilitate the access to the first active surface of the die.

A method of forming an electronic device, comprising:

• forming an opening in a substrate having a plurality of electrically conductive layers;
• physically attaching a die to the substrate to position a first active surface portion of the die adjacent the opening of the substrate and, through this physical attachment, electrically connecting the die to at least some of the electrically conductive layers in the substrate, the die further including a second active surface portion exposed through an opening of the die:
• forming a protective package to house the substrate and the die, the protective package leaving the opening of the substrate and the opening of the die exposed;
• forming a barrier element surrounding the opening of the substrate, the barrier element comprising a ring in contact with the substrate and the die, and whose external edge is completely coated by the protective package;
• and
• forming electric connections to electrically couple the die to the substrate outside the barrier element with respect to the first active surface.