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US 8,796,058 B2Granted
Semiconductor structure
AssigneeInternational Business Machines Corporation
InventorsRussell T. Herrin, Daniel R. Miga, Anthony K. Stamper
Life of this patent
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Abstract
Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.
Claims17
A method comprising:
- forming one or more metrology structure, during formation of a device in a chip area;
- venting the one or more metrology structure after formation of the device;
- forming at least one of an insulator and conductor material over the sacrificial material and the one or more metrology structure;
- forming at least one vent hole in the at least one of insulator and conductor material to expose the sacrificial material and the one or more metrology structure;
- and
- sealing the at least one vent hole over the vented sacrificial material after the venting, wherein:
- the one or more metrology structure and sacrificial material are vented through the at least one vent hole;
- the device is a Micro-Electro-Mechanical System (MEMS) structure, and
- the one or more metrology structure is formed simultaneously with the sacrificial material used to form one or more cavities of the MEMS structure.
6 more elements
A method comprising:
- forming a first layer of sacrificial material in a chip area;
- forming a metrology structure in a kerf area, the metrology structure being formed of same material as the sacrificial material;
- forming a second layer of the sacrificial material over the first layer of sacrificial material and in contact with at least one exposed portion of the first layer of sacrificial material;
- forming at least one of an insulator and conductor material over the metrology structure and the second layer of sacrificial material;
- forming vent holes exposing the second layer of the sacrificial material and the metrology structure;
- venting the first layer of sacrificial material, the second layer of sacrificial material and the metrology structure, through the vent holes;
- and
- sealing the vent holes over the vented second layer of sacrificial material.
5 more elements
Dependencies are inferred from the claim text.