Bonding apparatus and method for display device
AssigneeSamsung Display Co., Ltd.
InventorDeok-Jun Choi
Life of this patent
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Abstract
A bonding apparatus for a display device includes a film bonding device for bonding an anisotropic conductive film to a display substrate; and a pressure device for bonding a driving chip to the anisotropic conductive film of the display substrate, wherein the pressure device includes a pressure head with a heat source, and a pressure tip attached to a lower surface of the pressure head and including a plurality of sub-pressure tips that are separated from each other.
Claims14
A bonding apparatus for a display device, the bonding apparatus comprising:
- a film bonding device for bonding an anisotropic conductive film to a display substrate;
- and
- a pressure device for bonding a driving chip to the anisotropic conductive film of the display substrate,
- wherein the pressure device comprises:
- a pressure head with a heat source, and
- a pressure tip attached to a lower surface of the pressure head and including a plurality of sub-pressure tips that are separated from each other.
A bonding method of a bonding apparatus for a display device, the method comprising:
- attaching an anisotropic conductive film to a chip on glass bonding portion of a display substrate;
- positioning a driving chip on the anisotropic conductive film attached to the chip on glass bonding portion;
- and
- bonding the driving chip on the anisotropic conductive film attached to the chip on glass bonding portion by using a pressure tip of a bonding apparatus for the display device,
- wherein the pressure tip respectively presses a portion of the driving chip through a plurality of sub-pressure tips that are separated from each other.
Dependencies are inferred from the claim text.