Method and apparatus for manufacturing white light-emitting device
AssigneeSamsung Electronics Co., Ltd.
InventorsCheol-jun Yoo, Seong-jae Hong, Tsuyoshi Tsutsui, Shin-kun Kim
Life of this patent
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Abstract
Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.
Claims14
A method of manufacturing a light-emitting device, the method comprising:
- forming a plurality of light emitting devices on a first main surface of a wafer;
- after forming the plurality of light emitting devices on the wafer, thinning the wafer by removing material from a second main surface of the wafer, wherein the second main surface opposes the first main surface;
- disposing the thinned wafer on a carrier film so that the second main surface of the wafer faces the carrier film;
- and
- forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer, wherein the phosphor layer faces and overlies the first main surface of the wafer,
- wherein the forming of the phosphor layer comprises:
- disposing the carrier film, on which the wafer is disposed, on a vacuum table;
- closely adhering and fixing the carrier film on the vacuum table by vacuum suction pressure;
- coating a phosphor paste on the first surface of the wafer;
- and
- forming the phosphor layer by hardening the phosphor paste, and
- wherein the vacuum table has a stepped structure, in which a center portion thereof protrudes to be higher than peripheral portions thereof.
A method of manufacturing a light-emitting device, the method comprising:
- forming a plurality of light-emitting devices on a first main surface of a wafer;
- after forming the plurality of light emitting devices on the wafer, thinning the wafer by removing material from a second main surface of the wafer, wherein the second main surface opposes the first main surface;
- separating the plurality of light-emitting devices formed on the wafer through dicing;
- arranging the separated light-emitting devices on a carrier film so that the second main surface of the wafer faces the carrier film;
- and
- forming a phosphor layer on an emission surface of the plurality of light-emitting devices arranged on the carrier film, wherein the phosphor layer faces and overlies the first main surface of the wafer,
- wherein the forming of the phosphor layer comprises:
- disposing the carrier film, on which the light-emitting devices are arranged, on a vacuum table;
- closely adhering and fixing the carrier film on the vacuum table by vacuum suction pressure;
- coating a phosphor paste on the light-emitting devices;
- and
- forming the phosphor layer by hardening the phosphor paste, and
- wherein the vacuum table has a stepped structure, in which a center portion thereof protrudes to be higher than peripheral portions thereof.
Dependencies are inferred from the claim text.