Underfill adhesion measurements at a microscopic scale
AssigneeInternational Business Machines Corporation
InventorsMaxime Cadotte, Marie-Claude Paquet, Julien Sylvestre
Life of this patent
Estimating the term…
Abstract
Methods and systems to method to determine an adhesion force of an underfill material to a chip assembled in a flip-chip module are provided. A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate. The method also includes forming a block from the layer of underfill material. The method further includes measuring a force required to shear the block from a surface of the flip-chip module.
Claims20
A method, comprising:
- forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate;
- removing the substrate to expose the layer of the underfill material;
- forming a block from the layer of underfill material, wherein the removing the substrate is performed prior to the forming the block;
- and
- measuring a force required to shear the block from a surface of the flip-chip module.
A method, comprising:
- forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate;
- forming a block from the layer of underfill material;
- and
- measuring a force required to shear the block from a surface of the flip-chip module,
- wherein the forming the block comprises forming a plurality of trenches in the layer of underfill material.
A method, comprising:
- forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate;
- forming a block from the layer of underfill material;
- and
- measuring a force required to shear the block from a surface of the flip-chip module,
- wherein the surface of the flip-chip module is a surface of the chip;
- and
- the measuring the force required to shear the block comprises shearing the block from the chip.
A method to determine an adhesion force of an underfill material to a surface in a flip-chip module, comprising:
- forming trenches in the underfill material, wherein the trenches create at least one free-standing block of the underfill material adhered to the surface;
- pressing a blade against a wall of the at least one block until the at least one block dislocates from the surface;
- and
- measuring a force applied by the blade during the dislocating of the at least one block from the surface.
A method comprising measuring adhesion of an underfill material to a chip at a plurality of locations on the chip, wherein the underfill material and the chip are included in a manufactured module, wherein the measuring comprises forming a plurality of trenches in the underfill material, wherein the trenches define a plurality of blocks of the underfill material.
Dependencies are inferred from the claim text.