Methods and apparatuses for roll-on coating
AssigneesDynamic Micro System, Semiconductor Equipment GmbH
InventorsLutz Rebstock, Klaus Conrad Wolke
Life of this patent
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Abstract
Methods and apparatuses for a deposition system are provided to deposit a thin coating layer on flat substrates, such as semiconductors or panels. In an embodiment, liquid supplied rollers accepting liquid media provide liquid chemicals to the substrates for coating the substrates. The liquid delivery system can control the flow and the pressure of the liquid to achieve optimum process condition with minimum excess waste. In another embodiment, rollers with non-uniform distribution of liquid media provide a non-uniform thickness profile on the substrates, which can be used to compensate for the non-uniformity of subsequent processes.
Claims19
A method for depositing a coating layer on a substrate, comprising:
- flowing a first fluid to an end of a first fluid-supplied roller, wherein the fluid is transferred to a portion of the outer surface of the first roller;
- flowing a second fluid to an end of a second fluid-supplied roller, wherein the fluid is transferred to a portion of the outer surface of the second roller,
- wherein the first fluid is different from the second fluid,
- wherein the first and second rollers are adjacent to each other and disposed on a same side of the substrate;
- contacting at least one of the first and second rollers to the substrate surface;
- and
- rotating the first and second rollers to produce the coating layer on the substrate surface, wherein the coating layer comprises a mixture of a first liquid coating formed by the first roller and a second liquid coating formed by the second roller,
- and wherein the coating layer is non-uniform in thickness in the direction along the length of the first or second roller, wherein the thickness non-uniformity is configured to compensate for a non-uniform subsequent process so that after the non-uniform subsequent process, a uniform coated substrate is achieved from the combination of the non-uniform coating and the non-uniform subsequent process.
A method for depositing a coating layer on a substrate, comprising:
- determining a non-uniform thickness profile of the coating layer, wherein the non-uniform thickness profile is configured to compensate for a non-uniform subsequent process so that after the non-uniform subsequent process, a uniform coated substrate is achieved from the combination of the non-uniform coating and the non-uniform subsequent process;
- flowing a fluid to an end of a fluid-supplied roller, wherein the fluid is transferred to a portion of the outer surface of the roller;
- contacting the roller to the substrate surface;
- and
- rotating the roller to produce the coating layer on the substrate surface, wherein the coating layer has the non-uniform thickness profile, wherein the non-uniform thickness profile is in a direction along the length of the roller.
A method for depositing a coating layer on a substrate, comprising:
- flowing a fluid to an end of a first and a second fluid-supplied rollers, wherein the fluid is transferred to a portion of the outer surface of the rollers;
- providing power to a lamp heater, wherein the lamp heater is disposed between the first and second fluid-supplied rollers;
- rotating the first roller to produce a first liquid coating on the substrate surface;
- exposing the first liquid coating layer to the lamp heater;
- rotating the second roller to produce a second liquid coating on the substrate surface, wherein the first and second liquid coatings mix to form a liquid mixture,
- and wherein the liquid mixture is non-uniform in thickness in the direction along the length of the first or second roller, wherein the thickness non-uniformity is configured to compensate for a non-uniform subsequent process so that after the non-uniform subsequent process, a uniform coated substrate is achieved from the combination of the non-uniform coating and the non-uniform subsequent process.
Dependencies are inferred from the claim text.