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US 8,794,501 B2Granted
Method of transferring a light emitting diode
AssigneeLuxVue Technology Corporation
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
Claims18
A method of transferring a micro LED to a receiving substrate comprising:
- positioning a transfer head over a carrier substrate having an array of micro LED structures disposed thereon, each micro LED structure comprising:
- a micro p-n diode;
- and
- a metallization layer, wherein the metallization layer is between the micro p-n diode and a bonding layer on the carrier substrate;
- heating the bonding layer for at least one of the micro LED structures above a liquidus temperature of the bonding layer to liquefy the bonding layer;
- picking up the micro p-n diode and the metallization layer for the at least one of the micro LED structures with the transfer head while the bonding layer is liquefied;
- and
- placing the micro p-n diode and the metallization layer for the at least one of the micro LED structures on the receiving substrate.
5 more elements
Dependencies are inferred from the claim text.