System and method for precision fabrication of micro- and nano-devices and structures

A system for fabricating micro- and nano-devices and structures, the system comprising a platform stage on which a substrate is positioned and moved during machining and a plurality of lasers and/or ion beams capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application,

• the micro- and nano-devices and structures including:
• Micro-Electro-Mechanical Systems (MEMS);
• Nano-Electro-Mechanical Systems (NEMS);
• Microsytems Nanosystems Photonics 3-D integration;
• heterogeneous integration;
• and Nanotechnology devices and structures,
• the micro- and nano-devices and structures having a range of depth, lateral or depth and lateral dimensions ranging from less than 10 nanometers to a plurality of millimeters.

A system for fabricating micro- and nano-devices and structures, the system comprising a platform stage on which a substrate is positioned and moved during machining, a close-loop control system and at least one laser or ion beam which is controlled and operated by the close-loop control system so as to be capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application,

• the micro- and nano-devices and structures including:
• Micro-Electro-Mechanical Systems (MEMS);
• Nano-Electro-Mechanical Systems (NEMS);
• Microsystems;
• Nanosystems;
• Photonics;
• 3-D integration;
• heterogeneous integration;
• and Nanotechnology devices and structures,
• the micro- and nano-devices and structures having a range of depth, lateral or depth and lateral dimensions ranging from less than 10 nanometers to a plurality of millimeters.

A method of fabricating of micro- and nano-devices and structures, the method comprising the steps of:

• providing a platform stage on which a substrate is positioned and moved during machining,
• providing a femto-second laser machining capability for performing machining on the substrate,
• providing a focused-ion beam machining capability for performing machining on the substrate,
• providing a plasma focused-ion beam machining capability for performing machining on the substrate, and
• providing a conventional laser machining capability for performing machining on the substrate
• the micro- and nano-devices and structures including:
• Micro-Electro-Mechanical Systems (MEMS);
• Nano-Electro-Mechanical Systems (NEMS);
• Microsytems;
• Nanosystems;
• Photonics;
• 3-D a intergration;
• heterogeneous integration;
• and Nanotechnology devices and structures
• the micro- and nano-devices and structures having a range of depth, lateral or depth and lateral dimensions ranging from nanometers to millimeters.

A method of fabricating micro- and nano-devices and structures, the method comprising the steps of providing a platform stage on which a substrate is positioned and moved during machining, providing a close-loop control system and providing at least one laser which is controlled and operated by the close-loop control system so as to be capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application,

• the micro- and nano-devices and structures including:
• Micro-Electro-Mechanical Systems (MEMS);
• Nano-Electro-Mechanical Systems (NEMS);
• Microsytems:
• Nanosystems;
• Photonics;
• 3-D integration;
• heterogeneous integration;
• and Nanotechnology devices and structures,
• the micro- and nano-devices and structures having a range of depth, lateral or depth and lateral dimensions ranging from less than 10 nanometers to a plurality of millimeters.

A method of fabricating micro- and nano-devices and structures, the method comprising the steps of providing a platform stage on which a substrate is positioned and moved during machining, providing a close-loop control system and providing at least one ion beam which is controlled and operated by the close-loop control system so as to be capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application,

• the micro- and nano-devices and structures including:
• Micro-Electro-Mechanical Systems (MEMS);
• Nano-Electro-Mechanical Systems (NEMS);
• Microsytems;
• Nanosystems;
• Photonics;
• 3-D integration:
• heterogeneous integration;
• and Nanotechnology devices and structures,
• the micro- and nano-devices and structures having a range of depth, lateral or depth and lateral dimensions ranging from less than 10 nanometers to a plurality of millimeters.

A method of fabricating micro- and nano-devices and structures, the method comprising the steps of providing a platform stage on which a substrate is positioned and moved during machining and providing a plurality of lasers and/or focused-ion beams capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application,

• the micro- and nano-devices and structures including:
• Micro-Electro-Mechanical Systems (MEMS):
• Nano-Electro-Mechanical Systems (NEMS);
• Microsytems;
• Nanosystems;
• Photonics;
• 3-D integration;
• heterogeneous integration;
• and Nanotechnology devices and structures,
• the micro- and nano-devices and structures having a range of depth, lateral or depth and lateral dimensions ranging from less than 10 nanometers to a plurality of millimeters.