# US 8,787,601 B2 · Condenser microphone

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- Number: US 8,787,601 B2
- Document ID: US8787601B2
- Status: Granted
- Kind: B2
- Application number: 11/677,465
- Filed: 2007-02-21
- Published: 2007-08-30
- Granted: 2014-07-22
- Earliest claimed: 2006-02-24
- Assignees: Yamaha Corporation
- Applicants: Toshihisa Suzuki; Yukitoshi Suzuki; Nariyasu Yaguchi; Kazushi Sakurauchi
- Inventors: Toshihisa Suzuki; Yukitoshi Suzuki; Nariyasu Yaguchi; Kazushi Sakurauchi
- Web page: https://patentgrep.com/patent/US8787601B2

## CPC

- H04R 19/005: {using semiconductor materials}
- B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers}
- B81B 2201/0257: Microphones or microspeakers
- B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
- H04R 2499/11: Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

A condenser microphone includes a substrate having a cavity, first and second spacers defining an opening, a diaphragm having a rectangular shape positioned inside of the opening, and a plate having a rectangular shape positioned just above the diaphragm. Plate joint portions integrally interconnected with two sides of the plate are directly attached onto the second spacer. Supports, which are attached onto the second spacer across the opening and project inwardly of the opening, are connected to the prescribed portions of the diaphragm via third spacers relatively to the other two sides of the plate. The center portion of the diaphragm can be designed in a multilayered structure, and the peripheral portion can be bent outwardly. In addition, both ends of the diaphragm are fixed in position, while free ends of the diaphragm vibrate due to sound waves.

## Claims

### Claim 1

A diaphragm, comprising:
a central portion defined by a first semiconductor layer located in a first plane, the central portion having an outer periphery;
a peripheral portion spaced from, and located outside of, the outer periphery of the central portion, the peripheral portion being defined by a second semiconductor layer located in the first plane; and
a bent portion coupling the central and peripheral portions, the bent portion including a third semiconductor layer located in a second plane which is spaced from the first plane, and a first insulating film connecting the third semiconductor layer to the central portion of the diaphragm and a second insulating film connecting the third semiconductor layer to the peripheral portion of the diaphragm.

### Claim 2 (depends on 1)

The diaphragm according to claim 1, wherein the central portion has a rectangular outer periphery and the peripheral portion is located outside opposite sides of the rectangle.

### Claim 3

A diaphragm, comprising:
a central portion defined by a first semiconductor layer located in a first plane, the central portion having an outer periphery;
first and second peripheral portions being spaced from, and located outside of, the outer periphery of the central portion, the first and second peripheral portions being defined by respective semiconductor layers located in the first plane and outside the outer periphery of the first layer; and
first and second bent portions respectively coupling the first and second peripheral portions to the central portion, each of the bent portions including a respective third semiconductor layer located in a second plane which is spaced from the first plane, and a respective first insulating film connecting its respective third semiconductor layer to the central portion of the diaphragm and a respective second insulating film connecting its respective third semiconductor layer to the peripheral portion of the diaphragm.

### Claim 4 (depends on 3)

The diaphragm according to claim 3, wherein the central portion has a rectangular outer periphery and the peripheral portions are located outside opposite sides of the rectangle.

### Claim 5

A condenser microphone, comprising:
a plate having a fixed electrode; and
a flexible diaphragm which vibrates in response to sound waves applied thereto, the flexible diaphragm including:
a central portion defined by a first semiconductor layer located in a first plane, the central portion having an outer periphery;
a peripheral portion spaced from, and located outside of, the outer periphery of the central portion, the peripheral portion being defined by a second semiconductor layer located in the first plane; and
a bent portion coupling the central and peripheral portions, the bent portion including a third semiconductor layer located in a second plane which is spaced from the first plane, a first insulating film connecting the third semiconductor layer to the central portion of the diaphragm and a second insulating film connecting the third semiconductor layer to the peripheral portion of the diaphragm.

### Claim 6 (depends on 5)

The condenser microphone of claim 5, wherein the central portion has a rectangular outer periphery and the peripheral portion is located on opposite sides of the rectangle.

### Claim 7

A condenser microphone, comprising:
a plate having a fixed electrode;
a flexible diaphragm which vibrates in response to sound waves applied thereto, the flexible diaphragm including:
a central portion defined by a first semiconductor layer located in a first plane, the central portion having an outer periphery;
first and second peripheral portions being spaced from, and located outside of, the outer periphery of the central portion, the first and second peripheral portions being defined by respective semiconductor layers located in the first plane and outside the outer periphery of the first layer; and
first and second bent portions respectively coupling the first and second peripheral portions to the central portion, each of the bent portions including a respective third semiconductor layer located in a second plane which is spaced from the first plane, a respective first insulating film connecting its respective third semiconductor layer to the central portion of the diaphragm and a respective second insulating film connecting its respective third semiconductor layer to the peripheral portion of the diaphragm.

### Claim 8 (depends on 7)

The diaphragm according to claim 7, wherein the central portion has a rectangular outer periphery and the peripheral portions are located outside opposite sides of the rectangle.