# US 8,787,414 B1 · Methods and systems for providing a low stress electrode connection > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,787,414 B1 - Document ID: US8787414B1 - Status: Granted - Kind: B1 - Application number: 13/606,733 - Filed: 2012-09-07 - Granted: 2014-07-22 - Earliest claimed: 2011-09-07 - Assignees: Science Research Laboratory, Inc. - Applicants: Aland K. Chin; Richard H. Chin - Inventors: Aland K. Chin; Richard H. Chin - Web page: https://patentgrep.com/patent/US8787414B1 ## CPC - H01S 5/4025: {Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence)} - H01S 5/02315: Support members, e.g. bases or carriers - H01S 5/02423: {Liquid cooling, e.g. a liquid cools a mount of the laser} - H01S 5/0233: Mounting configuration of laser chips - H01S 5/02345: Wire-bonding - H01S 5/0235: Method for mounting laser chips - H01S 5/4018: {Lasers electrically in series} - H10W 40/30: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 72/07554: {changes in dispositions} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 72/5522: {comprising gold [Au]} - H10W 72/884: {Die-attach connectors and bond wires} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Systems and methods for providing a low stress electrode connection capable of carrying a high electrical current to an edge-emitting device, such as a laser diode are described. Systems and methods for providing mechanisms to allow precise adjustment of the relative position of one heat-sink for an optical edge emitting device relative to an adjacent heat-sink in a stack of heat-sinks are also provided herein. ## Claims ### Claim 1 A system comprising: a cooling component; a laser diode disposed on the cooling component; an anode of the laser diode being electrically coupled and attached to the cooling component; a base component; the cooling component being disposed on and attached to the base component; the base component being electrically connected to the cooling component; a mechanical support component disposed on the base component and surrounding the cooling component and the laser diode; the mechanical support component being electrically isolated from the cooling component and the base component; and a connection plate component disposed over a cathode of the laser diode and over the mechanical support component and configured to be mechanically attached to the mechanical support component by means of a push attachment component and a pull attachment component; wherein the push attachment component and the pull attachment component are configured to provide substantially controlled position of the connection plate component to the mechanical support component; the connection plate component being electrically connected to the mechanical support component and the cathode of the laser diode. ### Claim 2 (depends on 1) The system of claim 1 further comprising a cover component disposed over the cooling component on a surface on which the laser diode is disposed on; the cover component configured to seal a water inlet and a water outlet on the surface; the mechanical support component comprising an opening configured to receive the cover component; the mechanical support component being electrically isolated from the cover component. ### Claim 3 (depends on 1) The system of claim 1 wherein the push attachment component is a push screw; and wherein the pull attachment component is a pull screw. ### Claim 4 (depends on 1) The system of claim 1 wherein an insulator electrically isolates the mechanical support component from the cooling component and the base component. ### Claim 5 (depends on 1) The system of claim 1 wherein the connection plate component comprises a number of groups of attachment locations; each group of attachment locations configured to receive one push attachment component and one pull attachment component. ### Claim 6 (depends on 5) The system of claim 5 wherein the one push attachment component is a push screw; and wherein the one pull attachment component is a pull screw. ### Claim 7 (depends on 5) The system of claim 5 wherein the number of groups of attachment locations is three (3). ### Claim 8 (depends on 1) The system of claim 1 wherein a layer of optoelectronic solder material is disposed on the laser diode; the layer of optoelectronic solder material being disposed between the laser diode and the mechanical support component. ### Claim 9 (depends on 8) The system of claim 8 wherein the optoelectronic solder material is Indium. ### Claim 10 A laser diode stack comprising: a number of laser diode systems, each laser diode system comprising: a cooling component; the cooling component having a number of groups of attachment locations; each group of attachment locations configured to receive one push attachment component and one pull attachment component and having three attachment locations; the three attachment locations being disposed substantially sequentially; the cooling component being in one of two configurations; in a first configuration, a first attachment location in each group of attachment locations being configured to receive a pull attachment component; in a second configuration, a last attachment location in each group of attachment locations being configured to receive a pull attachment component; and a laser diode disposed on the cooling component; an anode of the laser diode being electrically coupled and attached to the cooling component; and at least one insulating component; said at least one insulating component being disposed over the cooling component on a surface on which the laser diode is disposed on; the at least one insulating component configured to hold a water inlet seal and a water outlet seal; said at least one insulating component being disposed away from the laser diode and the number of groups of attachment locations; wherein said at least one insulating component is located between each two consecutive laser diode systems in the laser diode stack; wherein said at least one insulating component is configured such that a cathode of the laser diode in one laser diode system is in direct electrical connection with the cooling component of another laser diode system; and wherein the cooling component of the one laser diode system is of one of the two configurations and the cooling component of said another laser diode system is of another configuration from the two configurations. ### Claim 11 (depends on 10) The laser diode stack of claim 10 wherein the one push attachment component is a push screw; and wherein the one pull attachment component is a pull screw. ### Claim 12 (depends on 10) The laser diode stack of claim 10 wherein the cooling component of a first laser diode system is disposed on and attached to a base component; the base component being electrically connected to the cooling component; and the laser diode stack further comprises; a mechanical support component disposed on the base component and surrounding the laser diode stack; the mechanical support component being electrically isolated from the laser diode stack and the base component; and a connection plate component disposed over a cathode of the laser diode in a last laser diode system and over the mechanical support component and configured to be mechanically attached to the mechanical support component by means of another push attachment component and another pull attachment component; wherein the another push attachment component and the another pull attachment component are configured to provide substantially controlled position of the connection plate component to the mechanical support component; the connection plate component being electrically connected to the mechanical support component and the cathode of the laser diode in the last laser diode system. ### Claim 13 (depends on 12) The laser diode stack of claim 12 wherein the mechanical support component comprises a number of layers; a first layer being disposed on the base component and a last layer being configured to be electrically connected to the mechanical support component and the cathode of the laser diode in the last laser diode system. ### Claim 14 (depends on 10) The laser diode stack of claim 10 wherein the one pull attachment component is electrically insulating. ### Claim 15 (depends on 14) The laser diode stack of claim 14 wherein the one pull attachment component is a pull screw; and wherein the one pull attachment component comprises an electrically insulating shoulder washer. ### Claim 16 (depends on 14) The laser diode stack of claim 14 wherein the one pull attachment component is a pull screw; and wherein the one pull attachment component is an insulating screw. ### Claim 17 (depends on 16) The laser diode stack of claim 16 wherein the insulating screw is a ceramic screw. ### Claim 18 A method for forming a low stress electrical connection for carrying a high electrical current in a laser diode system, the method comprising: placing a laser diode on a cooling component; an anode of the laser diode being electrically coupled and attached to the cooling component; attaching the cooling component to a base component; the base component being electrically connected to the cooling component; disposing a mechanical support component on the base component; the mechanical support component surrounding the cooling component and the laser diode and being electrically isolated from the cooling component and the base component; and placing a connection plate component over a cathode of the laser diode and over the mechanical support component; the connection plate component being configured to be mechanically attached to the mechanical support component by means of a push attachment component and a pull attachment component; wherein the push attachment component and the pull attachment component are configured to provide substantially controlled position of the connection plate component to the mechanical support component; the connection plate component being electrically connected to the mechanical support component and the cathode of the laser diode. ### Claim 19 (depends on 18) The method of claim 18 further comprising: disposing a cover component over a surface of the cooling component on which the laser diode is disposed on; the cover component configured to seal a water inlet and a water outlet on the surface; the mechanical support component comprising an opening configured to receive the cover component; the mechanical support component being electrically isolated from the cover component. ### Claim 20 A method for forming a low stress electrical connection in a laser diode stack, the method comprising: incorporating at least one mechanical adjustment mechanism in each laser diode system of a number of laser diode systems in the laser diode stack; the at least one mechanical adjustment mechanism comprising one push attachment component and one pull attachment component; said each laser diode system comprising a cooling component and a laser diode disposed in the cooling component; an anode of the laser diode being electrically coupled and attached to the cooling component; and disposing an insulating component between each two consecutive laser diode systems in the laser diode stack; the insulating component being configured such that a cathode of the laser diode in one laser diode system is in direct electrical connection with the cooling component of another laser diode system when the insulating component is disposed between the one laser diode system and the another laser diode system. ### Claim 21 (depends on 20) The method of claim 20 wherein each cooling component comprises a number of groups of attachment locations; each group of attachment locations configured to receive one mechanical adjustment mechanism and having three attachment locations; and wherein the cooling component being in one of two configurations; in a first configuration, a first attachment location in each group of attachment locations being configured to receive the one pull attachment component; in a second configuration, a last attachment location in each group of attachment locations being configured to receive the one pull attachment component. ### Claim 22 (depends on 20) The method of claim 20 wherein the one pull attachment component is electrically insulating. ### Claim 23 (depends on 22) The method of claim 22 wherein the one pull attachment component is a pull screw; and wherein the one pull attachment component comprises an electrically insulating shoulder washer. ### Claim 24 (depends on 22) The method of claim 22 wherein the one pull attachment component is a pull screw; and wherein the one pull attachment component is an insulating screw.