# US 8,787,034 B2 · Co-support system and microelectronic assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,787,034 B2 - Document ID: US8787034B2 - Status: Granted - Kind: B2 - Application number: 13/839,402 - Filed: 2013-03-15 - Published: 2014-02-27 - Granted: 2014-07-22 - Earliest claimed: 2012-08-27 - Assignees: Invensas Corporation - Applicants: Invensas Corporation - Inventors: Richard Dewitt Crisp; Belgacem Haba; Wael Zohni - Web page: https://patentgrep.com/patent/US8787034B2 ## CPC - B81B 7/007: {Interconnections between the MEMS and external electrical signals} - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 90/00: Package configurations - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/241: {Dispositions, e.g. layouts} - H10W 90/291: {characterised by containers, encapsulations, or other housings for the stacked chips} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A system includes a microelectronic assembly having terminals and a microelectronic element, and a component for connection with the microelectronic assembly. The component includes a support structure bearing conductors configured to carry command and address information, and contacts coupled to the conductors and connected with the terminals of the microelectronic assembly. The contacts have address and command information assignments arranged in a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the contacts at a first sampling rate, and in a second predetermined arrangement for connection with a second type of microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts at a second sampling rate greater than the first sampling rate. ## Claims ### Claim 1 A system, comprising: a microelectronic assembly which includes a set of terminals and a microelectronic element having a memory storage array having a given number of storage locations, the microelectronic element of the assembly having inputs connected with the terminals for receiving command and address information specifying one of the storage locations; and a component for connection with the microelectronic assembly, the component including: a support structure bearing a set of conductors configured to carry the command and address information; and a plurality of contacts coupled to the set of conductors, the contacts electrically connected with corresponding ones of the terminals of the microelectronic assembly, wherein the contacts have address and command information assignments arranged in (a) a first predetermined arrangement for connection with a first type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through the contacts at a first sampling rate, the contacts having a first number thereof, and in (b) a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts including a second number of the contacts at a second sampling rate being greater than the first sampling rate, the subset including some contacts occupying identical positions with the contacts that are assigned to the first predetermined arrangement, the second number being fewer than the first number. ### Claim 2 (depends on 1) The system of claim 1, wherein all of the contacts of the subset of contacts arranged according to the second predetermined arrangement occupy identical positions with the contacts that are assigned to the first predetermined arrangement. ### Claim 3 (depends on 1) The system of claim 1, wherein the second sampling rate is an integer multiple of the first sampling rate. ### Claim 4 (depends on 1) The system of claim 1, further comprising a device coupled to the set of conductors, the device being operable to drive the command and address information to the contacts. ### Claim 5 (depends on 4) The system of claim 4, wherein the device is configured to operate in each of first and second modes for connection of the component with the first type microelectronic assembly via the first arrangement, and with the second type microelectronic assembly via the second arrangement, respectively. ### Claim 6 (depends on 1) The system of claim 1, further comprising at least one central processing unit (“CPU”), the CPU configured to control operations of a plurality of components in the system including read operations from the microelectronic assembly and write operations to the microelectronic assembly. ### Claim 7 (depends on 1) The system of claim 1, further comprising a power supply configured to supply power for use by the component and the microelectronic assembly. ### Claim 8 (depends on 5) The system of claim 5, wherein the microelectronic assembly is the first type microelectronic assembly. ### Claim 9 (depends on 5) The system of claim 5, wherein the microelectronic assembly is the second type microelectronic assembly. ### Claim 10 (depends on 1) The system of claim 1, wherein the component is a circuit panel, and the contacts are exposed at a surface of the circuit panel. ### Claim 11 (depends on 10) The system of claim 10, wherein the microelectronic assembly is a microelectronic package, and wherein the terminals are surface mount terminals exposed at a surface of the microelectronic package. ### Claim 12 (depends on 10) The system of claim 10, wherein the circuit panel is a motherboard. ### Claim 13 (depends on 10) The system of claim 10, wherein the circuit panel is a module card, the module card including one or more rows of exposed module contacts, at least one of the rows of module contacts disposed adjacent an edge of the first or second surfaces for mating with contacts of a socket of a second circuit panel when the module is inserted in the socket. ### Claim 14 (depends on 1) The system of claim 1, wherein the component is a circuit panel, and the contacts are disposed in a socket electrically connected with the circuit panel. ### Claim 15 (depends on 14) The system of claim 14, wherein the microelectronic assembly includes a module card having first and second opposed surfaces, and wherein the terminals are a plurality of parallel exposed terminals adjacent an edge of at least one of the first and second surfaces for mating with the contacts of the socket when the module is inserted in the socket. ### Claim 16 (depends on 1) The system of claim 1, wherein the component is a circuit panel and the contacts are disposed in a connector electrically connected with the circuit panel, wherein the microelectronic assembly includes a module card having first and second opposed surfaces, and wherein the terminals are a plurality of parallel terminals exposed at one of the first and second surfaces for mating with the contacts of the connector when the module is attached to the connector. ### Claim 17 (depends on 1) The system of claim 1, wherein the microelectronic assembly is a first microelectronic assembly and the component is a second microelectronic assembly, and the contacts are terminals of the second microelectronic assembly. ### Claim 18 (depends on 17) The system of claim 17, wherein the second microelectronic assembly is coupled to the support structure and includes a microelectronic element having active devices therein, and the microelectronic element of the first microelectronic assembly is coupled with the microelectronic element of the second microelectronic assembly by electrical connections that extend only within the first and second microelectronic assemblies. ### Claim 19 (depends on 18) The system of claim 18, wherein the electrical connections between the microelectronic element of the first microelectronic assembly and the microelectronic element of the second microelectronic assembly include interconnection elements extending in a direction normal to a surface of the second microelectronic assembly at which the terminals of the second microelectronic assembly are exposed, the interconnection elements being configured for package-on-package stacking. ### Claim 20 (depends on 17) The system of claim 17, wherein the second microelectronic assembly is coupled to the support structure and includes a microelectronic element having active devices therein, the terminals of the second microelectronic assembly being exposed at a surface of the microelectronic element of the second microelectronic assembly. ### Claim 21 (depends on 20) The system of claim 20, wherein the microelectronic element of the second microelectronic assembly is a first microelectronic element, the second microelectronic assembly further comprising at least one second microelectronic element each having active devices therein, the first and second microelectronic elements arranged in a stacked configuration. ### Claim 22 (depends on 21) The system of claim 21, wherein the terminals of the second microelectronic assembly are electrically connected with the set of conductors of the support structures by through-silicon vias extending through the at least one second microelectronic element. ### Claim 23 (depends on 20) The system of claim 20, wherein the microelectronic element of the second microelectronic assembly includes a logic function. ### Claim 24 (depends on 1) The system of claim 1, wherein the contacts are first contacts and the conductors are a first set of conductors, the component further comprising a plurality of second contacts coupled to a second set of conductors, the second contacts configured for connection with corresponding terminals of the microelectronic assembly, the second contacts being configured to carry information other than the command and address information. ### Claim 25 (depends on 1) The system of claim 1, wherein the microelectronic element in the first type of the microelectronic assembly is of type DDRx, and the microelectronic element in the second type of the microelectronic assembly is of type LPDDRx. ### Claim 26 A system, comprising: a microelectronic assembly which includes a set of terminals and a microelectronic element having a memory storage array having a given number of storage locations, the microelectronic element of the assembly having inputs connected with the terminals for receiving command and address information specifying one of the storage locations; and a component for connection with the microelectronic assembly, the component including: a support structure bearing a set of conductors configured to carry the command and address information; and a plurality of contacts coupled to the set of conductors, the contacts electrically connected with corresponding ones of the terminals of the microelectronic assembly, wherein the contacts have address and command information assignments arranged in (a) a first predetermined arrangement for connection with a first type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a first subset of the contacts including a first number of the contacts, and in (b) a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a second subset of the contacts including a second number of the contacts, the first and second subsets including some contacts occupying identical positions, the second number being fewer than the first number. ### Claim 27 (depends on 26) The system of claim 26, wherein the command and address information of the first type of the microelectronic assembly includes parity information, the microelectronic element in the first type of the microelectronic assembly is configured to sample the parity information, and the second subset of the contacts for connection with the second type of the microelectronic assembly is not configured to sample the parity information. ### Claim 28 (depends on 26) The system of claim 26, wherein the microelectronic element in the second type of the microelectronic assembly is of type DDR3, and the microelectronic element in the first type of the microelectronic assembly is of type DDR4. ### Claim 29 (depends on 28) The system of claim 28, wherein the command and address information of the first type of the microelectronic assembly having the DDR4 type microelectronic element includes parity information, and the DDR4 type microelectronic element in the first type of the microelectronic assembly is configured to sample the parity information. ### Claim 30 (depends on 26) The system of claim 26, wherein the microelectronic element in the second type of the microelectronic assembly is of type DDRx, and the microelectronic element in the first type of the microelectronic assembly is of type DDR(x+1).