# US 8,786,819 B2 · Plastic flat display and method for manufacturing same

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- Number: US 8,786,819 B2
- Document ID: US8786819B2
- Status: Granted
- Kind: B2
- Application number: 12/161,498
- Filed: 2007-01-19
- Published: 2010-08-05
- Granted: 2014-07-22
- Earliest claimed: 2006-01-20
- Assignees: Intellectual Discovery Co., Ltd.
- Applicants: Seok-Hong Jeong; Hyun-Ha Hwang
- Inventors: Seok-Hong Jeong; Hyun-Ha Hwang
- Web page: https://patentgrep.com/patent/US8786819B2

## CPC

- G02F 1/133305: {Flexible substrates, e.g. plastics, organic film}
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- G02F 1/133553: {Reflecting elements (associated to illuminating devices G02F1/133605)}
- G02F 1/1681: having two or more microcells partitioned by walls, e.g. of microcup type
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

The present invention provides a plastic flat display and a method for manufacturing the same. In a plastic flat display including upper and lower substrates, the lower substrate is formed of an FPCB substrate for supplying an electrical signal to the plastic flat display. Accordingly, a flexible printed circuit board (FPCB) is used in an integrated type to serve as a lower substrate film of the flat display, so that an additional lower substrate is not necessary and the flat display can be implemented with a simple structure, and a method for manufacturing the plastic flat display.

## Claims

### Claim 1

A method for manufacturing a plastic flat display, comprising:
a first process of preparing an upper indium tin oxide (ITO) film substrate by bonding a transparent ITO film substrate on a base film, and preparing a lower flexible printed circuit board (FPCB) electrode substrate;
a second process of patterning the upper ITO film substrate after the first process;
a third process of printing an alignment layer on the upper ITO film substrate;
a fourth process of printing an alignment layer on the lower FPCB electrode substrate;
a fifth process of printing a thermosetting sealant on the upper ITO film substrate and distributing spacers on the lower FPCB electrode substrate after the fourth process;
a sixth process of aligning and coupling the upper ITO film substrate and the lower FPCB electrode substrate with each other through thermal pressing after the fifth process; and
a seventh process of injecting liquid crystals under a vacuum condition into a space between the upper ITO film substrate and the lower FPCB electrode substrate after the sixth process,
wherein the lower FPCB electrode substrate is an integrated type substrate for supplying an electrical signal to the plastic flat display,
wherein the lower FPCB electrode substrate includes a base film, a copper electrode laminated on the base film, and a gold plating layer laminated on the copper electrode, and a protection film laminated on a part of a region of the gold plating layer,
wherein the fourth process is performed by coating the alignment layer on the gold plating layer uncovered by the protection film in the lower FPCB electrode substrate, and
wherein the sixth process is performed by aligning the alignment layer of the upper ITO film substrate and the alignment layer on the gold-plating layer of the lower FPCB.

### Claim 2

A plastic flat display, comprising:
an upper transparent electrode substrate, which comprises a base film, an ITO layer laminated on the base film, an alignment layer coated on the ITO layer;
a lower FPCB electrode substrate, which comprises a base film, a copper electrode laminated on the base film, a gold plating layer laminated on the copper electrode, a protection film laminated on a part of a region of the gold plating layer and an alignment layer coated on the gold plating layer uncovered by the protection film;
liquid crystals interposed between the upper transparent electrode substrate and the lower FPCB electrode substrate,
wherein the lower FPCB electrode substrate is an integrated type substrate for supplying an electrical signal to the plastic flat display, and
wherein the alignment layer of the upper transparent electrode substrate and the alignment layer on the gold plating layer of the lower FPCB electrode substrate are aligned.