# US 8,786,498 B2 · Antenna and method for making same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,786,498 B2 - Document ID: US8786498B2 - Status: Granted - Kind: B2 - Application number: 13/474,829 - Filed: 2012-05-18 - Published: 2013-05-16 - Granted: 2014-07-22 - Earliest claimed: 2011-11-11 - Assignees: Shenzhen Futaihong Precision Industry Co., Ltd.; FIH (Hong Kong) Limited - Applicants: Chwan-Hwa Chiang; Jia-Lin Chen - Inventors: Chwan-Hwa Chiang; Jia-Lin Chen - Web page: https://patentgrep.com/patent/US8786498B2 ## CPC - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/40: Radiating elements coated with or embedded in protective material - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An antenna includes a transparent substrate, a silver layer directly formed on a surface of the transparent substrate, an ink layer made of an electroconductive ink directly formed on the silver layer, and a transparent protective layer directly formed on the silver layer. The silver layer forms a desired antenna pattern and has a feed portion and grounding portion. The ink layer covers the feed portion and the grounding portion. The protective layer covers the silver layer besides the feed portion and the grounding portion. A method for making the antenna is also described. ## Claims ### Claim 1 An antenna, comprising: a transparent substrate; a silver layer directly formed on a surface of the transparent substrate, the silver layer forming a desired antenna pattern and having a feed portion and grounding portion; an ink layer directly formed on the silver layer and covering the feed portion and the grounding portion, the ink layer made of an electroconductive ink; and a protective layer directly formed on the silver layer and covering the entire silver layer except the feed portion and the grounding portion, the protective layer being transparent. ### Claim 2 (depends on 1) The antenna as claimed in claim 1, wherein the thickness of the silver layer is about 5 nm to about 25 nm ### Claim 3 (depends on 1) The antenna as claimed in claim 1, wherein the sheet resistance of the silver layer is about 1.9 Ω/sq to about 2.1 Ω/sq. ### Claim 4 (depends on 1) The antenna as claimed in claim 1, wherein the antenna has an average transmission of visible light greater than 40%. ### Claim 5 (depends on 1) The antenna as claimed in claim 1, wherein the transparent substrate is made of plastic. ### Claim 6 (depends on 5) The antenna as claimed in claim 5, wherein the transparent substrate is made of polymethyl methacrylate. ### Claim 7 (depends on 6) The antenna as claimed in claim 6, wherein the transmission of light with a wavelength of about 550 nm of the antenna is about 45% to about 55%. ### Claim 8 (depends on 1) The antenna as claimed in claim 1, wherein the transparent substrate is made of glass. ### Claim 9 (depends on 1) The antenna as claimed in claim 1, wherein the electroconductive ink mainly comprises organic polymer and electroconductive substance. ### Claim 10 (depends on 9) The antenna as claimed in claim 9, wherein the organic polymer is a copolymer resin of chlorinated alkene, alkene acetate, and methacrylic hydroxyl. ### Claim 11 (depends on 9) The antenna as claimed in claim 9, wherein the electroconductive substance is micron-sized silver powder or copper wrapped silver powder. ### Claim 12 (depends on 1) The antenna as claimed in claim 1, wherein the ink layer has a thickness of about 1 μm to about 50 μm, with a transmission of visible light greater than 85%. ### Claim 13 A method for making an antenna, comprising: providing a transparent substrate; forming a silver layer defining a desired antenna pattern on the substrate, the silver layer having a feed portion and a grounding portion; forming a transparent protective layer on the silver layer, the protective layer covering the entire silver layer except the feed portion and the grounding portion; forming an ink layer on the feed portion and the grounding portion, the ink layer made of an electroconductive ink. ### Claim 14 (depends on 13) The method as claimed in claim 13, wherein the step of forming the silver layer includes the steps of: masking the substrate using a first masking film, the first masking film having an opening, the opening having a shape of the desired antenna pattern; vacuum sputtering the silver layer on the substrate, the silver layer initially covering the first masking film and portions of the substrate exposed from the opening; removing the first masking film and portions of the silver layer formed thereon. ### Claim 15 (depends on 14) The method as claimed in claim 14, wherein the first masking film is adhesive tape. ### Claim 16 (depends on 14) The method as claimed in claim 14, wherein during the vacuum sputtering process, the substrate masked using the first masking film is held on a rotating bracket in a chamber of a sputtering machine; the speed of the rotating bracket is between about 2.5 rpm and about 3.5 rpm; the chamber maintains an internal pressure in a range from about 6.5×10−3 Pa to about 9.5×10−3 Pa and the inside of chamber maintains a temperature between about 15° C. and about 55° C.; argon is fed into the chamber to create a partial pressure of about 0.2 Pa to about 0.6 Pa in the chamber; about 1.0 kW-4.0 kW of power is applied to a silver target fixed in the chamber; the vacuum sputtering process takes about 15 seconds to about 45 seconds. ### Claim 17 (depends on 13) The method as claimed in claim 13, wherein the step of forming the protective layer includes the steps of: masking the feed portion and the grounding portion by a second masking film; spraying a transparent resin paint layer on the substrate, the transparent resin paint layer covering at least the silver layer and the second masking film; removing the second masking film and portions of the transparent resin paint layer formed thereon. ### Claim 18 (depends on 17) The method as claimed in claim 17, wherein the second masking film is adhesive tape. ### Claim 19 (depends on 13) The method as claimed in claim 13, wherein the silver layer has a thickness of about 5 nm to about 25 nm.