# US 8,786,186 B2 · Organic light emitting diode display with adhesive layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,786,186 B2 - Document ID: US8786186B2 - Status: Granted - Kind: B2 - Application number: 13/333,873 - Filed: 2011-12-21 - Published: 2012-12-13 - Granted: 2014-07-22 - Earliest claimed: 2011-06-10 - Assignees: Samsung Display Co., Ltd. - Applicants: Jung-Hyun Son; Hoon Kim - Inventors: Jung-Hyun Son; Hoon Kim - Web page: https://patentgrep.com/patent/US8786186B2 ## CPC - B32B 37/12: characterised by using adhesives - C09J 11/04: inorganic - H10K 50/8426: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 50/844: Encapsulations - H10K 50/846: {comprising getter material or desiccants} - H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 59/874: {including getter material or desiccant} - H10K 71/50: Forming devices by joining two substrates together, e.g. lamination techniques - B32B 2457/206: Organic displays, e.g. OLED - H10K 59/873: {Encapsulations} - H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass - H10K 2102/331: {Nanoparticles used in non-emissive layers, e.g. in packaging layer} - Y10T 156/10: Methods of surface bonding and/or assembly therefor - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate. ## Claims ### Claim 1 An organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed between the substrate and the encapsulation substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate, wherein the adhesive layer is formed by sequentially accumulating: a) a first filling adhesive layer, b) a hygroscopic adhesive layer not contacting either of the organic light emitting element or the encapsulation substrate and c) a second filling adhesive layer; wherein the adhesive layer includes thermally curable resin or photocurable resin; and wherein the first filling adhesive layer, the hygroscopic adhesive layer and the second filling adhesive layer include the same kind of thermally curable resin or photocurable resin so that the adhesive layer is formed as one integrated sheet without forming an interface between the layers. ### Claim 2 (depends on 1) The organic light emitting diode (OLED) display of claim 1, wherein the hygroscopic adhesive layer includes at least one hygroscopic material selected from the group consisting of silica gel (SiO2.H2O), alumino-silicate beads, montmorillonite, a molecular sieve of zeolite (Na12AlO3SiO2.12H2O), activated carbon, alkali metal oxide, alkaline earth metal oxide, metal sulfate, metal halide and metal perchlorate. ### Claim 3 (depends on 1) The organic light emitting diode (OLED) display of claim 1, wherein the first filling adhesive layer and the second filling adhesive layer independently include at least one filling material selected from the group consisting of talc, silica, magnesium oxide, mica, montmorillonite, alumina, graphite, beryllia (beryllium oxide), aluminum nitride, silicon carbide, mullite and silicon. ### Claim 4 (depends on 2) The organic light emitting diode (OLED) display of claim 2, wherein the filling material or hygroscopic material has a particle diameter of about 10 nm to about 20 μm. ### Claim 5 (depends on 3) The organic light emitting diode (OLED) display of claim 3, wherein the filling material or hygroscopic material has a particle diameter of about 10 nm to about 20 μm. ### Claim 6 (depends on 2) The organic light emitting diode (OLED) display of claim 2, wherein the hygroscopic material or the filling material is mesoporous, plate-shaped, spherical, rod-shaped, fiber-shaped, or core-shell typed. ### Claim 7 (depends on 3) The organic light emitting diode (OLED) display of claim 3, wherein the hygroscopic material or the filling material is mesoporous, plate-shaped, spherical, rod-shaped, fiber-shaped, or core-shell typed. ### Claim 8 (depends on 1) The organic light emitting diode (OLED) display of claim 1, wherein the hygroscopic adhesive layer comprises about 100 parts by weight of thermally curable resin or photocurable resin; and about 5 to about 50 parts by weight of hygroscopic material. ### Claim 9 (depends on 1) The organic light emitting diode (OLED) display of claim 1, wherein the first filling adhesive layer and the second filling adhesive layer independently comprise about 100 parts by weight of thermally curable resin or photocurable resin; and about 5 to about 50 parts by weight of filling material. ### Claim 10 (depends on 1) The organic light emitting diode (OLED) display of claim 1, wherein the adhesive layer has a thickness of about 5 μm to about 30 μm. ### Claim 11 (depends on 1) The organic light emitting diode (OLED) display of claim 1, wherein in the adhesive layer, the thickness ratio of the first filling adhesive layer, hygroscopic adhesive layer and the second filling adhesive layer is about 0.1 to about 1.2:about 0.1 to about 1.2:about 0.1 to about 1.2.