# US 8,786,172 B2 · Fluorescent member and light emitting module

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- Number: US 8,786,172 B2
- Document ID: US8786172B2
- Status: Granted
- Kind: B2
- Application number: 13/715,385
- Filed: 2012-12-14
- Published: 2013-05-23
- Granted: 2014-07-22
- Earliest claimed: 2010-08-06
- Assignees: Koito Manufacturing Co., Ltd.
- Applicants: Koito Manufacturing Co., Ltd.
- Inventors: Yasuaki Tsutsumi; Masanobu Mizuno; Takashi Onishi
- Web page: https://patentgrep.com/patent/US8786172B2

## CPC

- C09K 11/7774: {Aluminates}
- B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12}
- B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)}
- C04B 35/44: based on aluminates
- C04B 35/62645: {Thermal treatment of powders or mixtures thereof other than sintering}
- C04B 35/62695: {Granulation or pelletising (devices for shaping artificial aggregates from ceramic mixtures B28B1/004)}
- H05B 33/12: Light sources with substantially two-dimensional [2D] radiating surfaces
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient}
- C04B 2235/3225: Yttrium oxide or oxide-forming salts thereof
- C04B 2235/3229: Cerium oxides or oxide-forming salts thereof
- C04B 2235/3418: Silicon oxide, silicic acids or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
- C04B 2235/5436: micrometer sized, i.e. from 1 to 100 micron
- C04B 2235/5445: submicron sized, i.e. from 0,1 to 1 micron
- C04B 2235/602: Making the green bodies or pre-forms by moulding
- C04B 2235/604: Pressing at temperatures other than sintering temperatures
- C04B 2235/764: Garnet structure A3B2(CO4)3
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 428/24273: including aperture
- Y10T 428/24479: including variation in thickness
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

In a plate-shaped fluorescent member configured to convert the wavelength of the light emitted by a semiconductor light emitting element, the fluorescent member is formed of an inorganic material having a refractive index of 1.5 or more and a light transmittance at the emission peak wavelength of the semiconductor light emitting element of less than 20%. A concave portion is formed, of the surfaces of the fluorescent member, on the surface on the side where the light in the semiconductor light emitting element is mainly emitted. In the fluorescent member, the light transmittance of the light having a wavelength of 380 nm to 500 nm may be less than 20%. The concave portion may be a groove. The concave portion may be a plurality of holes that are scattered.

## Claims

### Claim 1

A plate-shaped fluorescent member configured to convert a wavelength of light emitted by a semiconductor light emitting element, wherein
the fluorescent member is formed of an inorganic material having a refractive index of at least 1.5 and a light transmittance at the emission peak wavelength of the semiconductor light emitting element of less than 20%, and wherein
a concave portion is formed, of surfaces of the fluorescent member, on a surface on a side where the light in the semiconductor light emitting element is mainly emitted,
a depth of the concave portion is at least 5 μm,
the concave portion comprises a plurality of scattered holes, and
a thickness of the fluorescent member at a bottom of the concave portion is 90 μm or less.

### Claim 2 (depends on 1)

The fluorescent member according to claim 1, wherein a minimum of the light transmittance of the light having a wavelength of 380 nm to 500 nm is less than 20%.

### Claim 3

A light emitting module comprising:
a semiconductor light emitting element; and
a fluorescent member provided so as to face the light emitting surface of the semiconductor light emitting element and configured to convert a wavelength of light emitted by the semiconductor light emitting element, wherein
the fluorescent member is formed of an inorganic material having a refractive index of at least 1.5 and a light transmittance at an emission peak wavelength of the semiconductor light emitting element of less than 20%,
a concave portion is formed, of surfaces of the fluorescent member, on a surface on a side where the light in the semiconductor light emitting element is mainly emitted,
a depth of the concave portion is at least 5 μm,
the concave portion comprises a plurality of scattered holes, and
a thickness of the fluorescent member at a bottom of the concave is 90 μm or less.

### Claim 4 (depends on 3)

The light emitting module according to claim 3, wherein in the fluorescent member, the concave portion is formed at a position facing at least part of an electrode in the semiconductor light emitting element.

### Claim 5 (depends on 3)

The light emitting module according to claim 3, wherein in the fluorescent member, the concave portion is formed in an area outside an outer circumference of the semiconductor light emitting element that the fluorescent member faces.