# US 8,786,109 B2 · Conductive structure and method for forming the same

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- Number: US 8,786,109 B2
- Document ID: US8786109B2
- Status: Granted
- Kind: B2
- Application number: 13/793,241
- Filed: 2013-03-11
- Published: 2013-11-07
- Granted: 2014-07-22
- Earliest claimed: 2012-05-07
- Assignees: ChipMOS Technologies Inc.
- Applicants: Chipmos Technologies Inc.
- Inventors: Chung-Pang Chi
- Web page: https://patentgrep.com/patent/US8786109B2

## CPC

- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 20/01: {Manufacture or treatment}
- H10W 20/43: Layouts of interconnections
- H10W 72/01235: {by plating, e.g. electroless plating or electroplating}
- H10W 72/01255: {by using masks}
- H10W 72/019: {of bond pads}
- H10W 72/232: {Plan-view shape, i.e. in top view}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 72/9445: {Top-view layouts, e.g. mirror arrays}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A conductive structure for a semiconductor chip and a method for forming the conductive structure are provided. The semiconductor chip comprises a plurality of first pads and second pads. The pad area is defined with a first area, a second area and a third area, wherein the first area is located between the second area and the third area. Each of the first pads and the second pads are interlaced to each other on the first area. The conductive structure comprises a plurality of conductive bumps formed on each of the first pads and the second pads respectively to electrically connect with each of the first pads and the second pads. Each of the conductive bumps has a first bump-width disposed on the first area and a second bump-width disposed on one of the second and third areas in which the first bump-width is shorter than the second bump-width.

## Claims

### Claim 1

A conductive structure for a semiconductor chip, the semiconductor chip comprising a semiconductor substrate, a plurality of first pads, a plurality of second pads, a passivation layer and a plurality of under bump metal layers, wherein each of the first pads and each of the second pads are alternately arranged on a pad area of the semiconductor substrate, the pad area defines a first area, a second area and a third area, the first area is located between the second area and the third area, each of the first pads and each of the second pads are interlaced with each other on the first area, and the first area is extending toward the second area and the third area respectively, and wherein the passivation layer formed on the semiconductor substrate has a plurality of first openings to partially expose each of the first pads and each of the second pads, and each of the under bump metal layers is formed on the passivation layer and is electrically connected with each of the first pads and each of the second pads through each of the first openings formed in the passivation layer, the conductive structure comprising:
a plurality of conductive bumps, formed on each of the first pads and each of the second pads respectively, each of the under bump metal layers being disposed under each of the conductive bumps so that each of the conductive bumps is electrically connected with each of the first pads and each of the second pads through each of the under bump metal layers,
wherein each of the conductive bumps has a first bump-width in the first area and a second bump-width in one of the second area and the third area, and the first bump-width is smaller than the second bump-width.

### Claim 2 (depends on 1)

The conductive structure as claimed in claim 1, wherein each of the conductive bumps is formed within each of the first openings to cover each of the first pads and each of the second pads and partially overlaps the passivation layer.

### Claim 3 (depends on 2)

The conductive structure as claimed in claim 2, wherein each of the conductive bumps is made of a material selected from a group consisting of Au, Cu, Ag, Ni, and alloys thereof.

### Claim 4 (depends on 3)

The conductive structure as claimed in claim 3, wherein a spacing distance between adjacent ones of the conductive bumps on the first area is between 6 μm and 8 μm.

### Claim 5 (depends on 4)

The conductive structure as claimed in claim 4, wherein each of the conductive bumps is made by an electroplating process.

### Claim 6

A method for forming a conductive structure of a semiconductor chip, the semiconductor chip comprising a semiconductor substrate, a plurality of first pads, a plurality of second pads, a passivation layer and an under bump metal layer, wherein each of the first pads and each of the second pads are alternately arranged on a pad area of the semiconductor substrate, the pad area defines a first area, a second area and a third area, the first area is located between the second area and the third area, each of the first pads and each of the second pads are interlaced with each other on the first area, and the first area is extending toward the second area and the third area respectively, and wherein the passivation layer formed on the semiconductor substrate has a plurality of first openings to partially expose the first pads and the second pads, and the under bump metal layer is formed on the passivation layer and covers each of the first pads and each of the second pads through each of the first openings formed in the passivation layer to electrically connect with each of the first pads and each of the second pads, the method comprising the steps of:
(a) forming a patterned insulation layer on the under bump metal layer, the patterned insulation layer being formed with a plurality of second openings to partially expose the under bump metal layer, wherein each of the second openings has a first opening-width in the first area and a second opening-width in one of the second area and the third area, and the first opening-width is smaller than the second opening-width;
(b) forming a conductive bump within each of the second openings to partially cover the under bump metal layer, the conductive bumps being disposed on each of the first pads and each of the second pads, wherein a shape of each of the conductive bumps corresponds to a shape of each of the second openings in such a way that a first bump-width of the conductive bump corresponds to the first opening-width and a second bump-width of the conductive bump corresponds to the second opening-width, and the first bump-width is smaller than the second bump-width; and
(c) removing the patterned insulation layer to expose each of the conductive bumps.

### Claim 7 (depends on 6)

The method as claimed in claim 6, further comprising a step (d) of removing the under bump metal layer located outside each of the conductive bumps after the step (c).

### Claim 8 (depends on 7)

The method as claimed in claim 7, wherein in the step (d), the under bump metal layer is removed through an etching process in which an etching rate in the first area is lower than an etching rate in the second area and the third area.

### Claim 9 (depends on 8)

The method as claimed in claim 8, wherein the patterned insulation layer is made of Polyimide, a Solder Resist, Benzocyclobutene, or a Siloxane Polymer.

### Claim 10 (depends on 9)

The method as claimed in claim 9, wherein each of the conductive bumps is made of a material selected from a group consisting of Au, Cu, Ag, Ni, and alloys thereof.

### Claim 11 (depends on 10)

The method as claimed in claim 10, wherein each of the conductive bumps is made by an electroplating process.