# US 8,786,095 B2 · Interconnect for an optoelectronic device

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- Number: US 8,786,095 B2
- Document ID: US8786095B2
- Status: Granted
- Kind: B2
- Application number: 13/854,607
- Filed: 2013-04-01
- Published: 2013-09-05
- Granted: 2014-07-22
- Earliest claimed: 2010-09-29
- Assignees: SunPower Corporation
- Applicants: SunPower Corporation
- Inventors: Ryan Linderman; Keith Johnston; Thomas Phu; Matthew Dawson
- Web page: https://patentgrep.com/patent/US8786095B2

## CPC

- H10F 19/90: Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers (between thin-film photovoltaic cells on a single substrate H10F19/35)
- H10F 19/70: comprising bypass diodes (bypass diodes in a junction box H02S40/34)
- H10F 19/80: Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F 19/902: {for series or parallel connection of photovoltaic cells}
- H10F 19/904: {characterised by the shapes of the structures}
- H10F 19/908: {for back-contact photovoltaic cells}
- H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H10F 77/63: Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- Y02E 10/50: Photovoltaic [PV] energy
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body.

## Claims

### Claim 1

An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends; and
a stress relief feature disposed in the interconnect body, the stress relief feature comprising a first narrow slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body, the first narrow slot positioned in a location approximately equally between the first and second ends, the first narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface.

### Claim 2 (depends on 1)

The interconnect of claim 1, wherein the stress relief feature further comprises a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces.

### Claim 3 (depends on 1)

The interconnect of claim 1, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 4 (depends on 1)

The interconnect of claim 1, wherein the stress relief feature further comprises:
a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface;
a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 5 (depends on 1)

The interconnect of claim 1, wherein the interconnect is a coupling interconnect.

### Claim 6 (depends on 1)

The interconnect of claim 1, wherein the interconnect is a terminal interconnect.

### Claim 7

An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;
a stress relief feature disposed in the interconnect body, the stress relief feature comprising a first narrow slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body, the first narrow slot positioned in a location approximately equally between the first and second ends, the first narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface;
a first L-shaped extension at the first end of the interconnect body; and
a second L-shaped extension at the second end of the interconnect body, the horizontal bases of each of the first and second L-shaped extensions proximate to the inner surface and distal from the outer surface of the interconnect body.

### Claim 8 (depends on 7)

The interconnect of claim 7, wherein the stress relief feature further comprises a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces.

### Claim 9 (depends on 7)

The interconnect of claim 7, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 10 (depends on 7)

The interconnect of claim 7, wherein the stress relief feature further comprises:
a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface;
a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 11 (depends on 7)

The interconnect of claim 7, wherein the interconnect is a coupling interconnect.

### Claim 12 (depends on 7)

The interconnect of claim 7, wherein the interconnect is a terminal interconnect.

### Claim 13

An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends; and
a stress relief feature disposed in the interconnect body, the stress relief feature comprising a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 14 (depends on 13)

The interconnect of claim 13, wherein the stress relief feature further comprises a first narrow slot in a location proximate to the first end and distal from the second end, the first narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a second narrow slot between the first narrow slot and the first end, the second narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces.

### Claim 15 (depends on 13)

The interconnect of claim 13, wherein the interconnect is a coupling interconnect.

### Claim 16 (depends on 13)

The interconnect of claim 13, wherein the interconnect is a terminal interconnect.