# US 8,786,079 B2 · Antenna switch modules and methods of making the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,786,079 B2
- Document ID: US8786079B2
- Status: Granted
- Kind: B2
- Application number: 13/570,077
- Filed: 2012-08-08
- Published: 2013-02-14
- Granted: 2014-07-22
- Earliest claimed: 2011-08-10
- Assignees: Skyworks Solutions, Inc.
- Applicants: Jong-Hoon Lee; Chuming Shih
- Inventors: Jong-Hoon Lee; Chuming Shih
- Web page: https://patentgrep.com/patent/US8786079B2

## CPC

- H01Q 1/50: Structural association of antennas with earthing switches, lead-in devices or lightning protectors
- H01P 11/001: {Manufacturing waveguides or transmission lines of the waveguide type}
- H10D 1/20: Inductors
- H10D 1/68: Capacitors having no potential barriers
- H10D 86/01: Manufacture or treatment
- H10D 86/80: characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H10W 44/601: {Capacitive arrangements (H10W44/20 takes precedence)}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 90/00: Package configurations
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49016: Antenna or wave energy "plumbing" making
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Antenna switch modules and methods of making the same are provided. In certain implementations, an antenna switch module includes a package substrate, an integrated filter, and a silicon on insulator (SOI) die attached to the package substrate. The SOI die includes a capacitor configured to operate in the integrated filter and a multi throw switch for selecting amongst the RF signal paths. In some implementations, a surface mount inductor is attached to the package substrate adjacent the SOI die and is configured to operate in the integrated filter with the capacitor. In certain implementations, the inductor is formed from a conductive layer of the package substrate disposed beneath a layer of the package substrate used to attach the SOI die.

## Claims

### Claim 1

An antenna switch module comprising:
a package substrate implemented to receive one or more electrical components;
a silicon on insulator (SOI) die including a first capacitor and a switch configured to be coupled to a plurality of radio frequency (RF) signal paths, the SOI die attached to the package substrate; and
a first integrated filter configured to filter an RF signal received on a first RF signal path of the plurality of RF signal paths, the first integrated filter including the first capacitor of the SOI die and a first inductor.

### Claim 2 (depends on 1)

The antenna switch module of claim 1 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers.

### Claim 3 (depends on 2)

The antenna switch module of claim 2 wherein the first inductor is formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

### Claim 4 (depends on 3)

The antenna switch module of claim 3 wherein the first inductor is a spiral inductor formed from trace of the first conductive layer.

### Claim 5 (depends on 3)

The antenna switch module of claim 3 wherein the first inductor is formed from trace of more than one of the plurality of conductive layers.

### Claim 6 (depends on 1)

The antenna switch module of claim 1 wherein the first inductor has an inductance ranging between about 2.5 nH and about 7 nH.

### Claim 7 (depends on 1)

The antenna switch module of claim 1 wherein the first inductor is a surface mount component attached to the package substrate adjacent the SOI die.

### Claim 8 (depends on 1)

The antenna switch module of claim 1 further comprising a second integrated filter configured to filter a RF signal received on a second RF signal path of the plurality of RF signal paths, the second integrated filter including a second capacitor of the SOI die and a second inductor.

### Claim 9 (depends on 8)

The antenna switch module of claim 8 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers, and the first and second inductors are formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

### Claim 10 (depends on 9)

The antenna switch module of claim 9 wherein the first and second inductors are separated by a column of vias in the package substrate.

### Claim 11

The antenna switch module of 8 claim wherein the first inductor includes a surface mount inductor attached to the package substrate adjacent the SOI die and the second inductor is formed at least partly from a first conductive layer of a plurality of conductive layers of the package substrate, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

### Claim 12 (depends on 8)

The antenna switch module of claim 8 wherein the first and second inductors include first and second surface mount inductors, respectively, the first and second surface mount inductors attached to the package substrate.

### Claim 13 (depends on 1)

The antenna switch module of claim 1 wherein the first capacitor has a capacitance ranging between about 0.8 pF and about 2.7 pF.

### Claim 14 (depends on 1)

The antenna switch module of claim 1 wherein the SOI die is electrically connected to the package substrate using bond wires.

### Claim 15 (depends on 1)

The antenna switch module of claim 1 wherein the SOI die is a flip-chip die that is electrically connected to the package substrate using solder bumps.

### Claim 16 (depends on 1)

The antenna switch module of claim 1 wherein the first inductor and first capacitor are electrically connected in series.

### Claim 17 (depends on 1)

The antenna switch module of claim 1 wherein the switch is a single pole multi-throw switch.

### Claim 18

An antenna switch module comprising:
a package substrate implemented to receive one or more electrical components;
a silicon on insulator (SOI) die including a capacitor and a switch configured to be coupled to a plurality of radio frequency (RF) signal paths, the SOI die attached to the package substrate; and
a means for filtering an RF signal received on a first RF signal path of the plurality of RF signal paths, the filtering means including the capacitor of the SOI die and an inductor associated with the package substrate.

### Claim 19 (depends on 18)

The antenna switch module of claim 18 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers.

### Claim 20 (depends on 19)

The antenna switch module of claim 19 wherein the inductor is formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

### Claim 21 (depends on 18)

The antenna switch module of claim 18 wherein the inductor is a surface mount component attached to the package substrate adjacent the SOI die.

### Claim 22

A wireless device comprising:
an antenna switch module including a package substrate, a silicon on insulator (SOI) die and an integrated filter, the SOI die including a capacitor and a switch electrically connected to a plurality of radio frequency (RF) signal paths, the SOI die attached to the package substrate, the integrated filter including the capacitor of the SOI die and an inductor, the integrated filter configured to filter an RF signal received on a first RF signal path of the plurality of RF signal paths.

### Claim 23 (depends on 22)

The wireless device of claim 22 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers.

### Claim 24 (depends on 23)

The wireless device of claim 23 wherein the inductor is formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

### Claim 25 (depends on 22)

The wireless device of claim 22 wherein the inductor is a surface mount component attached to the package substrate adjacent the SOI die.

### Claim 26 (depends on 22)

The wireless device of claim 22 further comprising an antenna electrically connected to the antenna switch module.

### Claim 27 (depends on 22)

The wireless device of claim 22 further comprising a transceiver electrically connected to the antenna switch module.

### Claim 28 (depends on 22)

The wireless device of claim 22 further comprising a Wi-Fi module electrically connected to the antenna switch module.

### Claim 29 (depends on 22)

The wireless device of claim 22 further comprising a mobile television module electrically connected to the antenna switch module.

### Claim 30 (depends on 22)

The wireless device of claim 22 further comprising a front-end module electrically connected to the antenna switch module.

### Claim 31 (depends on 22)

The wireless device of claim 22 further comprising a power amplifier module electrically connected to the antenna switch module.

### Claim 32 (depends on 22)

The wireless device of claim 22 wherein the inductor and capacitor are electrically connected in series.

### Claim 33 (depends on 22)

The wireless device of claim 22 wherein the switch is a single pole multi-throw switch.

### Claim 34 (depends on 10)

The antenna switch module of claim 10 wherein the column of vias is configured to inhibit electric and magnetic fields of the first inductor from interfering with electric and magnetic fields of the second inductor.